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HI3516ERBCV300
HI3516ERBCV300
| Part Number | Hi3516ERBCV300 |
|---|---|
| Manufacturer | HiSilicon |
| Category | Integrated Circuits (ICs) > Embedded – System On Chip (SoC) / Video Processors |
| Description | High-performance, ultra-low-power HD IP Camera SoC integrating an advanced H.265/H.264 video compression encoder, next-generation ISP, and embedded neural network acceleration engine for smart surveillance and IoT vision. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The HI3516ERBCV300 is a highly integrated, industry-leading High-Definition (HD) IP Camera System-on-Chip (SoC) developed by HiSilicon, tailored specifically for the professional video surveillance, smart home security, and IoT edge-vision markets. Built on a low-power, high-efficiency processor architecture, this monolithic chip seamlessly unifies an advanced image signal processor (ISP), a high-performance H.265/H.264 video compression engine, and an embedded hardware acceleration block for lightweight intelligent algorithms. The is designed to deliver crystal-clear image quality under extreme low-light environments while simultaneously drastically cutting network bandwidth and storage costs through its state-of-the-art encoder technologies. With rich peripheral interfaces, integrated audio codecs, and robust hardware security layers, this SoC provides a cost-effective, single-chip solution that enables equipment manufacturers to quickly deploy smart, high-definition camera architectures in a highly compact design footprint.
Core Advantages
Advanced H.265 High-Efficiency Video Encoding
Integrates a next-generation H.265/H.264 multi-stream encoder that delivers ultra-high-definition video compression, reducing bitrate storage requirements and network bandwidth load by up to 50% compared to legacy architectures.
Professional-Grade Image Signal Processing (ISP)
Features an elite built-in ISP that supports 3D denosing, digital wide dynamic range (WDR), backlight compensation, and advanced low-light scene adaptation, ensuring high-fidelity color reproduction and sharp forensic detail in any lighting condition.
Edge AI and Intelligent Video Analysis Acceleration
Incorporates an embedded hardware-accelerated intelligence engine capable of running edge-based video analytics such as motion detection, human boundary crossing, object classification, and face tampering alerts without overloading the primary CPU.
Ultra-Low Power Consumption and Small Form Factor
Engineered with advanced low-power process nodes and aggressive dynamic power scaling, making it highly suitable for fanless miniature camera housings, battery-powered smart doorbells, and compact IoT vision nodes.
Key Specifications
| Brand | HiSilicon |
|---|---|
| RoHS Status | RoHS 10 Compliant, Lead-Free packaging |
| EDA/CAD Model | 3D Model & PCB Footprint Available upon request |
| Warranty | 1-Year Standard Factory Warranty |
| Package / Case | TFBGA-288(12×12mm ) |
| Mounting Type | Surface Mount Technology (SMD/SMT) |
| Surface Marking / Silkscreen | Hi3516ERBCV300 Marking |
| Processor Core Architecture | ARM Cortex-A7 single core, with NEON media processing engine and FPU floating-point unit |
| Maximum Encoding Resolution | Max single stream 4MP (2560×1440)@30fps, multi-stream support for 1080P/3MP/720P |
| Video Codec Protocols | H.265 / H.264 / MJPEG Baseline, Main, and High Profile Standards |
| Sensor Interface Support | MIPI CSI, Sub-LVDS, HiSPI, Parallel CMOS Sensors Interfaces |
| Memory Support Subsystem | Supports SIP integrated DDR3L memory, external DDR3L interface available |
| Audio Interface | Integrated Audio Codec supporting 16-bit audio input/output, I2S protocol |
| Network Communication Ports | Integrated RMII Ethernet MAC interface, supports 10/100 Mbps data rates |
| Peripheral Connectivity | USB 2.0 Host/Device, SDIO 2.0, UART, SPI, I2C, PWM, and GPIO Matrices |
| Security Engine Encryption | Hardware AES/DES/3DES encryption algorithms and secure boot mechanism |
| Operating Temperature Range | Industrial grade: -40℃ ~ +85℃ ambient working temperature |
Typical Applications
- Professional Network IP Surveillance Cameras (Bullet, Dome, and Pan-Tilt-Zoom Form Factors)
- Smart Home Security Ecologies, Wireless Wi-Fi Indoor Cameras, and Baby Monitors
- Intelligent Video Doorbells, Battery-Powered Porch Cam Hubs, and Smart Electronic Peep-holes
- Industrial Vision Inspection Terminals, Edge Sensoring IoT Gateway Nodes, and Drone First-Person View (FPV) Modules
- Automotive Dashcams, Commercial Fleet Monitoring Systems, and Mobile Law Enforcement Bodycams
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: Is your current stock inventory of the HI3516ERBCV300 SoC completely factory-original?
A: Yes, we guarantee that all HI3516ERBCV300 components in our warehouse inventory are 100% brand-new, factory-original products from HiSilicon, kept and handled under strict anti-static ESD shielding and dry-pack moisture-control guidelines.
Q2: Does the HI3516ERBCV300 support the newer H.265 compression format, and what are its exact benefits?
A: Yes, this SoC features full hardware-level H.265 encoding support. Compared to legacy H.264 processors, H.265 reduces video file size and network streaming bandwidth by roughly 50% while maintaining the identical high-definition image clarity, saving substantial storage drive costs.
Q3: Can this chip be deployed in battery-powered, outdoor smart security hardware products?
A: Absolutely. The Hi3516ERBCV300 is optimized with a low-power process and fast-boot code initialization layers. This allows the processor to remain in a micro-ampere sleep state and wake up instantly to capture event-driven video when triggered by an external PIR sensor, preserving battery lifespan.
Q4: How can our engineering group download the SDK architecture documents, pin configurations, or request bulk wholesale pricing tiers?
A: Please complete our Quick Inquiry web form on this page with details about your processing parameters. Our application support desk will process your inquiry and dispatch the available technical documentation package within 24 hours.
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