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HI3516ARBCV100
HI3516ARBCV100
| Part Number | HI3516ARBCV100 |
|---|---|
| Manufacturer | HiSilicon |
| Category | Integrated Circuits (ICs) > Embedded – System On Chip (SoC) / Multimedia Processors |
| Description | High-performance HD IP camera SoC integrating single-core ARM Cortex-A7@600MHz, next-generation ISP, high-efficiency H.265/H.264 video compression engine, built-in NNIE intelligent analysis acceleration, packaged in TFBGA345 form factor. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The HI3516ARBCV100 is a highly integrated professional HD IP Camera System-on-Chip (SoC) developed by HiSilicon. Designed for low-power, high-performance video surveillance, smart security and edge visual capture devices, it adopts single-core ARM Cortex-A7@600MHz architecture. The chip integrates advanced ISP pipeline and hardware H.265/H.264 encoder, supporting real-time 1080p multi-stream encoding with lower bitrate and storage consumption. Built-in 2-frame WDR, 3D DNR, lens distortion correction, 6-DOF image stabilization and NNIE intelligent acceleration engine, it supports motion detection, line crossing, tamper detection and target framing. Integrated audio codec, RTC, POR and abundant peripheral interfaces reduce peripheral PCB components. Packaged in compact TFBGA345, it provides cost-effective, thermally stable single-chip solution for HD surveillance cameras and edge vision equipment.
Core Advantages
Advanced H.265 Video Compression Engine
Integrates multi-stream hardware encoding architecture with H.265 high profile, cutting network bandwidth and NVR storage consumption by up to 50% compared with H.264 encoding.
Professional High-Performance ISP Pipeline
Supports multi-exposure 2F WDR, Bayer/3D digital noise reduction, 3A auto-exposure/white balance/autofocus, lens distortion correction, regional dehaze and 6-axis electronic image stabilization, delivering clear images under complex lighting conditions.
Embedded NNIE Intelligent Video Analytics
Dedicated NNIE hardware accelerator for edge-side intelligent algorithms, including motion detection, line-crossing alarm, object tamper detection and target framing, offloading video analysis tasks on-chip without extra processing chips.
Optimized Low-Power and High-Density Integration
Integrates audio codec, RTC, power management circuit and full physical interfaces on single silicon, greatly shrinking PCB layout area and lowering overall system power consumption.
Key Specifications
| Brand | HiSilicon |
|---|---|
| RoHS Status | RoHS Compliant / Lead-Free / Green Environmental Materials standard Certified |
| EDA/CAD Model | 3D STEP Models, Schematic Symbols, and PCB footprint configurations available upon request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | TFBGA345 |
| Mounting Type | Surface Mount Technology (SMD/SMT Reflow Solder Line Assembly) |
| Surface Marking / Silkscreen | HI3516ARBCV100 Marking |
| Processor Core | Single-core ARM Cortex-A7 @ 600MHz |
| Core Operating Voltage | 1.1V Typical Core Supply Voltage |
| I/O Interface Voltage | 3.3V Standard IO Operating Voltage |
| DDR Interface Voltage | 1.35V / 1.5V for DDR3 / DDR3L Memory |
| Typical Power Consumption | ≈1.1W under 1080P@30fps Full Load Working Status |
| Max Supported DDR Capacity | Up to 1GB DDR3L SDRAM |
| Audio Processing | Built-in 16-bit Audio Codec, I²S Audio Input & Output Support |
| Video Encoding Capability | Multi-stream encoding support up to 1080p @ 30fps H.265/H.264 baseline/main/high profile |
| Multi-Stream Quantity | Supports up to 3 independent video encoding streams simultaneously |
| Image Signal Processor (ISP) | Integrated 2-frame WDR, 3D DNR, lens distortion correction, defect pixel concealment, 6-DOF EIS and full 3A algorithm |
| Sensor Input Interfaces | Supports high-speed multi-lane MIPI CSI-2, Sub-LVDS, and HiSPi image sensor connections |
| External Storage Interface | High-speed DDR3 / DDR3L memory controller port supporting low-power system layouts |
| Peripheral Connectivity | Integrated 10/100 Mbps Ethernet MAC, USB 2.0 Host/Device, SDIO 2.0, I²S, UART, and SPI blocks |
| Supported Network Protocols | ONVIF, RTSP, HTTP, TCP/IP, UDP for surveillance system integration |
| Operating Temperature Range | -20°C to +70°C (Commercial Standard Wide Temperature Range) |
Typical Applications
- Professional High-Definition (HD) Network IP Surveillance Cameras and Smart Dome Cameras
- Smart Home Security Hardware, Connected Video Doorbells, and Wireless Indoor Monitor Units
- Enterprise Video Conferencing Terminals, Edge Vision Processing Hubs, and Face Scanning Access Gates
- Automotive Dash Cams, Fleet Telematics Visual Tracking Modules, and Mobile Security Carts
- Industrial Machine Vision Nodes, Robotic Vision Guidance Systems, and Distributed IoT Visual Sensors
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: Is your currently available stock of the HI3516ARBCV100 100% original and genuine?
A: Yes, we guarantee that all HI3516ARBCV100 processors in our warehouse stock are 100% brand-new, factory-original parts directly from HiSilicon. Every single batch goes through strict incoming trace inspections and is stored and shipped in original anti-static JEDEC trays to completely shield the delicate BGA contacts from physical shock or oxidation.
Q2: What is the primary operational advantage of upgrading a design from H.264 to H.265 using the HI3516A processor?
A: The primary advantage is data and bandwidth efficiency. The integrated hardware H.265 codec engine inside the HI3516ARBCV100 compresses high-definition video frames up to twice as efficiently as older H.264 platforms. This allows cameras to stream ultra-clear 1080p security footage using half the network bandwidth, significantly lowering storage cost footprints for local storage cards or cloud network servers.
Q3: Does this SoC interface directly with standard CMOS image sensors without a secondary conversion chip?
A: Yes, it is fully capable of direct interface. The HI3516ARBCV100 is engineered with highly versatile embedded analog and digital sensor interfaces, including high-speed MIPI CSI-2, Sub-LVDS, and HiSPi lanes, allowing direct connectivity to industry-leading high-resolution CMOS imaging sensors from major manufacturers.
Q4: How can our physical engineering group secure the full register mapping references or request tiered volume pricing?
A: Please enter your precise project metrics and target purchase volume into our Quick Inquiry web form found directly on this product page. Our specialized digital signal processing and embedded multimedia application support desk will review your submission and respond with official data assets and customized tier-pricing brackets within 24 hours.
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