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XC4VFX12-10SFG363I
XC4VFX12-10SFG363I
| Part Number | XC4VFX12-10SFG363I |
|---|---|
| Manufacturer | AMD Xilinx |
| Category | Integrated Circuits (ICs) > Embedded – FPGAs (Field Programmable Gate Array) |
| Description | Virtex-4 FX family platform FPGA featuring an integrated IBM PowerPC 405 processor core, high-speed RocketIO serial transceivers, 12,312 logic cells, and advanced DSP blocks in a lead-free 363-pin flip-chip BGA package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The XC4VFX12-10SFG363I is a highly capable and versatile member of the legacy Xilinx® Virtex®-4 FX platform family, engineered to combine high-density programmable logic with powerful embedded hardware processing capabilities.
Built on mature 90nm triple-oxide silicon architecture, this FPGA embeds high-performance IBM® PowerPC® 405 RISC processor core, paired with dedicated RocketIO™ multi-gigabit serial transceivers. It carries 12,312 logic cells, 32 specialized XtremeDSP™ slices and abundant Block RAM resources.
High-bandwidth internal interconnects link the embedded processor subsystem and serial transceivers directly to programmable logic fabric. Packaged in compact lead-free 363-pin Flip-Chip BGA, it supports industrial-grade temperature range, delivering stable long-term operation for telecommunications, aerospace, industrial automation and multi-protocol bridge equipment.
Core Advantages
Embedded Hardware IBM PowerPC Core
Integrates fully hardened IBM PowerPC 405 RISC processor macro inside silicon fabric, delivering fast deterministic code execution and low-latency hardware control without occupying programmable logic cells.
High-Speed RocketIO Transceiver Architecture
On-chip multi-gigabit serial transceivers support high-bandwidth data transmission, eliminating layout clock skew when connecting standard multi-lane serial backplane interfaces.
Dedicated XtremeDSP™ Slices
32 independent hardware DSP blocks enable continuous parallel high-speed computation, suitable for real-time signal filtering, mathematical algorithms and video signal processing tasks.
Industrial-Grade Reliability and Lifecycle Integrity
Rated for continuous operation from -40°C up to +100°C junction temperature, providing stable hardware performance for mission-critical long-lifetime industrial and aerospace deployments.
Key Specifications
| Brand | AMD Xilinx® Virtex®-4 FX High-Performance FPGA Family |
|---|---|
| RoHS Status | RoHS Compliant / Lead-Free / Green Manufacturing Processes Certified (“G” Suffix) |
| EDA/CAD Model | 3D STEP Models, Schematic Symbols, and Pinout Footprint Configurations available upon request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 363-FBGA, FCBGA (17mm × 17mm) |
| Mounting Type | Surface Mount Technology (SMD/SMT Lead Reflow Solder Assembly) |
| Surface Marking / Silkscreen | XC4VFX12 SFG363 Marking |
| Embedded Processor Core | 1x IBM PowerPC 405 RISC Core Macro |
| Speed Grade Configuration | -10 Nominal Execution Speed Level |
| Total Logic Cells | 12,312 Logic Cells |
| Logic Array Blocks (CLB Slices) | 1,368 Configurable Logic Block (CLB) Slices containing Flip-Flops and Look-Up Tables |
| XtremeDSP™ Slices | 32 Specialized Hardware DSP Blocks for parallel computation |
| Total Block RAM (BRAM) | 648 Kbit of embedded high-speed memory blocks |
| RocketIO™ Transceiver Lanes | 4 Integrated Multi-Gigabit Serial Transceiver Channels (MGT), 622Mbps ~ 6.5Gbps per lane |
| User I/O Pin Count | 240 User-Assignable General-Purpose Input/Output Lines |
| Security Feature | Built-in AES Bitstream Encryption Anti-Cloning Function |
| Core Supply Voltage | 1.2V Core Operating Voltage |
| I/O Bank Voltage Support | 1.5V, 1.8V, 2.5V, 3.3V Multi-Voltage IO Standard Support |
| Differential I/O Pairs | Up to 96 LVDS Differential Signal Pairs for High-Speed Interface |
| Typical Static Power | 1.1W Quiescent Power Consumption at 25°C Ambient Temperature |
| Maximum Processor Clock Speed | 300MHz Max Operating Frequency for IBM PowerPC 405 Core |
| Operating Temperature Range | -40°C to +100°C Junction Temperature (T_J) Industrial-Grade Boundaries |
Typical Applications
- High-Speed Telecommunication Backplanes, Network Routers, and Protocol Bridging Hubs
- Aerospace Avionic Flight Controls, Precision Telemetry Systems, and Radar Signal Tracking
- Industrial Control Platforms, High-End Robotics Modules, and Distributed CNC Controller Logic
- Legacy Medical Imaging Equipment, Specialized Diagnostic Arrays, and Data Acquisition Systems
- Test and Measurement Instruments, Fast Oscilloscope Hardware, and Custom RF Simulators
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet download, sample requests, stock verification and bulk pricing, fill out the Quick Inquiry form. We guarantee a reply within 24 hours.
Frequently Asked Questions
Q1: Is XC4VFX12-10SFG363I in your stock 100% genuine original?
A: Yes, all XC4VFX12-10SFG363I FPGAs are brand-new original AMD Xilinx factory stock.
Every batch will go through strict incoming quality inspection before storage.
All chips are delivered in original JEDEC ESD moisture-proof trays to avoid BGA ball oxidation and physical damage during shipping.
Q2: What is the core difference between Virtex-4 FX, LX and SX series?
A: Virtex-4 family has three optimized product lines:
– LX: For high-density general logic design
– SX: Optimized for heavy DSP signal processing
– FX: Dedicated embedded SoC platform
FX series like XC4VFX12 integrate hardened PowerPC 405 processor + RocketIO multi-gigabit transceivers for complete embedded system design.
Q3: What do SFG363 and suffix I mean in this part number?
A: SFG363 represents lead-free fine-pitch Flip-Chip BGA package with 363 solder balls.
Suffix I stands for industrial temperature grade, supporting long-term operation from -40°C to +100°C junction temperature.
Q4: How to get full technical manuals and tiered bulk price quotes?
A: Submit the Quick Inquiry form with your project details and required order quantity.
Our professional FPGA technical team will send official datasheets, register reference documents and customized bulk pricing within 24 hours.
Q5: Can I get free test samples of XC4VFX12-10SFG363I for project verification?
A: Sample testing service is available. Submit your sample demand via the inquiry form, we will confirm sample cost and shipping schedule for you promptly.
Q6: What is the MOQ and lead time of this FPGA?
A: MOQ starts at 1 piece for spot inventory.
In-stock orders can be dispatched within 1-2 working days, global delivery takes 3-7 working days via DHL, UPS, FedEx or EMS.
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