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BCM3390ZRKFSBG
BCM3390ZRKFSBG
| Part Number | BCM3390ZRKFSBG |
|---|---|
| Manufacturer | Broadcom Limited |
| Category | Integrated Circuits (ICs) > Interface – Telecom / Broadband SoC |
| Description | DOCSIS 3.1 Cable Modem and Gateway System-on-Chip (SoC) featuring multi-gigabit data throughput, integrated Full-Band Capture (FBC) digital tuners, and advanced application processing architecture, housed in a Pb-free BGA package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The BCM3390ZRKFSBG is a high-performance DOCSIS® 3.1 gateway SoC developed by Broadcom. It delivers multi-gigabit bandwidth over HFC networks, fully supporting DOCSIS 3.1 OFDM/OFDMA while compatible with DOCSIS 3.0/2.0 and Euro-DOCSIS. Equipped with multi-core processors, hardware packet accelerators and integrated FBC digital tuners, it handles high-speed data, VoIP and Wi-Fi tasks simultaneously. This power-efficient chip serves as a scalable platform for smart home hubs, edge routers and 4K media gateways.
Core Advantages
Multi-Gigabit DOCSIS 3.1 Performance
Adopts OFDM and LDPC correction to realize multi-gigabit transmission, meeting demands of 4K/8K streaming, cloud computing and low-latency gaming.
Integrated Full-Band Capture (FBC) Technology
Supports full-spectrum real-time scanning, reduces external RF components, and enables remote network spectrum diagnosis.
High-Efficiency Hardware Acceleration
Dedicated packet acceleration engine achieves wire-speed forwarding without occupying main processor resources.
Highly Integrated Gateway Architecture
Natively connects Wi-Fi chips, Ethernet switches and VoIP modules to simplify PCB layout for residential gateways.
Key Specifications
| Brand | Broadcom Corporation / Broadcom Limited Broadband Interface Series |
|---|---|
| RoHS Status | RoHS Compliant / Pb-Free / Green Halogen-Free Materials Sourced (“G” Suffix) |
| EDA/CAD Model | 3D STEP Models, Schematic Symbols, and Pinout Footprint Configurations available upon request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | Ball Grid Array (BGA) Package |
| Mounting Type | Surface Mount |
| Surface Marking / Silkscreen | BCM3390ZRKFSBG Marking |
| Standard Protocol | DOCSIS 3.1 Compliant, Backward Compatible with DOCSIS 3.0, 2.0, and Euro-DOCSIS |
| Downstream Configuration | Supports multi-channel OFDM channels and up to 32 bonded SC-QAM channels |
| Upstream Configuration | Supports active OFDMA channels and up to 8 bonded SC-QAM channels |
| Tuner Technology | Integrated Full-Band Capture (FBC) Digital Front-End Tuner Engine |
| Interface Networking Support | Multi-Gigabit Ethernet (RGMII/SGMII), PCI Express (PCIe), and High-Speed USB Control Blocks |
| Memory Architecture | Supports DDR3 / DDR3L Memory Interface |
| Operating Temperature Range | 0°C to +70°C Commercial Temperature Range |
| Input Supply Voltage | 3.3V Main Analog & Digital Supply |
| Core Supply Voltage | 1.0V Internal Processor Core Voltage |
| Number Of Cores | Dual-Core ARM Application Processor |
| Data Rate Downstream Max | 10Gbps DOCSIS 3.1 OFDM Downstream Throughput |
| Data Rate Upstream Max | 1Gbps OFDMA Upstream Throughput |
| Storage Interface | SPI Flash, NAND Flash Support |
| Clock Frequency | 1GHz Maximum Processor Core Clock Speed |
| Moisture Sensitivity Level (MSL) | MSL 3 (168 Hours Floor Life at 30°C / 60% RH) |
Technical Support
Submit the Quick Inquiry form for datasheets, samples, stock checks and bulk quotations. We will reply within 24 hours.
Frequently Asked Questions
Q1: Are your BCM3390ZRKFSBG chips 100% original?
A1: Yes, all chips are brand-new original from Broadcom. We store components in ESD & moisture-proof cabinets and ship with factory sealed packaging to avoid oxidation or pin damage.
Q2: What does suffix RKFSBG stand for?
A2: RKFSB stands for temperature grade, built-in accelerator and silicon version; the suffix G means halogen-free, lead-free RoHS BGA package.
Q3: What advantages does integrated FBC technology bring?
A3: It scans full cable spectrum up to 1.2GHz, cuts external RF components, reduces power loss, and supports remote spectrum diagnosis.
Q4: How to handle heat dissipation for this BGA chip?
A4: Use multi-layer PCB with ground thermal vias under BGA pads. Aluminum passive heatsink or TIM material is recommended; contact us for PCB layout guides.
Q5: Can I get free samples for testing?
A5: Small free samples are available for customer evaluation. Fill in the inquiry form to apply with your project information.
Q6: What is your typical delivery lead time?
A6: In-stock items ship within 1-3 working days; out-of-stock bulk orders take 2-4 weeks depending on quantity.
Q7: What is your product warranty period?
A7: All original chips come with a 1-year quality warranty against factory defects.
Q8: Is this chip compatible with DOCSIS 3.0 devices?
A8: Yes, it is fully backward compatible with DOCSIS 3.0, 2.0 and Euro-DOCSIS standards.
Q9: Do you provide bulk discount for large orders?
A9: We offer tiered volume discounts. Submit your required quantity via the inquiry form for exclusive pricing.
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