MPC561MZP56
| Part Number | MPC561MZP56 |
|---|---|
| Manufacturer | NXP Semiconductors / Freescale |
| Category | Integrated Circuits (ICs) > Embedded – Microcontrollers (MCU) |
| Description | 32-Bit PowerPC e300 RISC Microcontroller, 56MHz, 32KB SRAM, TPU3, Dual QADC, TouCAN, Automotive Grade, 388-PBGA Package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The MPC561MZP56 is a high-performance 32-bit embedded microcontroller from NXP (formerly Freescale). Built on PowerPC e300 RISC core running at 56 MHz, this ROMless MCU targets automotive engine control, transmission management, avionics and heavy industrial equipment. Equipped with 32KB on-chip SRAM, independent TPU3 timing processor, dual QADC64 analog modules and multi-channel TouCAN bus, it is packaged in 388-ball PBGA to deliver stable real-time performance under wide temperature range.
Core Advantages
High-Performance 32-Bit PowerPC Core
32-bit PowerPC e300 RISC core operating at 56 MHz with integrated FPU, supporting real-time closed-loop control and complex mathematical algorithms.
Autonomous TPU3 Co-Processor
Dedicated TPU3 unit independently generates PWM, engine timing and motor control signals without occupying main CPU resources.
Dual QADC Multi-Channel Sampling Module
Two QADC64 units provide total 32 x 10-bit analog input channels, auto-completing sampling conversion to reduce CPU interrupt load for multi-sensor acquisition.
388-Pin Compact PBGA Package
388-ball PBGA with 27mm×27mm body, featuring high pin count, low EMI interference and excellent heat dissipation for harsh industrial & automotive environments.
Key Specifications
| Brand | NXP / Freescale MPC5xx Microcontroller Series |
|---|---|
| RoHS Status | Fully Lead-Free & RoHS Compliant |
| EDA/CAD Model | Schematic symbols, 3D CAD step profiles, and 388-PBGA footprint land patterns are available on request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 388-PBGA (27mm x 27mm) |
| Mounting Type | Surface Mount (SMT / SMD) |
| Surface Marking / Silkscreen | MPC561MZP56 / NXP / Freescale logo Marking |
| Processor Core | 32-Bit PowerPC e300 RISC Core with FPU |
| Max Operating Frequency | 56 MHz |
| On-Chip RAM | 32 KB High-Speed Static RAM (SRAM) |
| Program Memory Type | ROMless, No On-Chip Flash/EEPROM, External Memory Required |
| Programmable I/O Count | 64 Programmable I/O Pins |
| ADC Specification | Dual QADC64 modules, total 32 x 10-bit analog input channels |
| Peripherals Integrated | Time Processor Unit (TPU3), Dual QADC64, 3-Ch TouCAN, QSMCM (SCI/UART/SPI/QSPI), PWM Generator, Watchdog Timer(WDT) |
| Bus / Expansion Interface | 32-bit External Bus Interface (EBI/EMI) supporting external Memory / Flash expansion |
| Debug Interface | Nexus Class 3, JTAG, BDM |
| Core Voltage ($V_{\text{DD}}$) | 2.5V ± 5% Core Logic Supply (2.5V ~ 2.7V) |
| I/O Voltage ($V_{\text{DDH}}$) | 5.0V ± 10% Standard Automotive/Industrial I/O Rail |
| Operating Temperature Range | -40°C to +125°C (Automotive / Heavy Industrial Grade) |
| Product Lifecycle Status | Obsolete / Not Recommended for New Designs |
Typical Applications
- Automotive powertrain control units (PCU), engine control units (ECU), and transmission controllers
- Heavy equipment automation, hydraulic valve controllers, and industrial motor drives
- Avionics flight control systems, aerospace instrumentation, and military subsystem controllers
- High-reliability industrial automation gateways, PLC master controllers, and robotics hubs
- Data acquisition units and multi-channel real-time signal processing equipment
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet download, sample requests, stock verification and bulk quotation, please fill out our quick inquiry form. Our sales team will respond to you within 24 hours.
Frequently Asked Questions
Q1: What is the main structural difference between MPC561 and other MPC5xx series MCUs?
A: MPC561 is a ROMless model without built-in Flash. It executes firmware via the 32-bit EBI external bus, supporting custom external Flash chips to match different project demands.
Q2: How does the TPU3 unit boost real-time system performance?
A: TPU3 is an independent co-processor. It processes high-frequency timing, PWM generation and sensor signal decoding separately, avoiding frequent CPU interrupts and saving main core computing resources.
Q3: What power supply voltages does MPC561MZP56 require?
A: Dual power rails are needed: 2.5V for internal core logic, and 5V for external I/O ports, analog ADC and CAN bus driver circuits.
Q4: What specifications do the suffix “MZP56” stand for?
A: M = -40℃~+125℃ automotive wide temperature grade; ZP = 388-ball PBGA packaging; 56 = maximum 56MHz operating frequency.
Q5: Is MPC561MZP56 still recommended for new product development?
A: This component has entered obsolete lifecycle. We recommend alternative automotive MCUs for new designs while spot stock is available for maintenance replacement.
Q6: How many analog sampling channels does the built-in ADC support?
A: Equipped with dual QADC64 modules, offering a total of 32 channels of 10-bit analog input for multi-sensor synchronous collection.
Q7: How many CAN bus channels are integrated on this chip?
A: It contains 3 independent TouCAN controllers, suitable for multi-node automotive bus communication systems.
Q8: What is the storage and operating temperature range of this MCU?
A: Operating temperature: -40℃ ~ +125℃; Storage temperature: -55℃ ~ +150℃, fully compliant with automotive industrial standards.
Q9: Can you provide samples of MPC561MZP56 for testing?
A: Small quantity samples are available upon request. Submit your sample demand through the inquiry form, we will confirm stock and sample lead time for you.
Q10: Are there compatible replacement models for MPC561MZP56?
A: We can offer equivalent MPC5 series ROMless automotive MCUs with identical PBGA packaging and peripheral resources. Contact our sales team for detailed cross-reference list.
