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NT5CB256M16DP-EK
NT5CB256M16DP-EK
| Part Number | NT5CB256M16DP-EK |
|---|---|
| Manufacturer | Nanya Technology |
| Category | Integrated Circuits (ICs) > Memory – DRAM |
| Description | 4 Gigabit (256M x 16‑Bit) DDR3 Synchronous DRAM, 1866Mbps (DDR3‑1866), 1.5V, 96‑Ball FBGA Package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The NT5CB256M16DP‑EK is a 4Gb DDR3 SDRAM chip from Nanya Technology. Internal organization is 256M x 16‑bit, supporting up to 1866 Mbps data rate with 1.5V supply voltage. It adopts 8n‑prefetch architecture and bidirectional data strobe for high‑bandwidth data transfer. Packaged in 96‑ball FBGA, this DRAM delivers good signal integrity, low power dissipation and stable thermal performance for consumer electronics, networking equipment, embedded systems and digital media devices.
Core Advantages
High Bandwidth & DDR3‑1866 Performance
Supports 1866 Mbps data rate with 13‑13‑13 CAS latency, ideal for fast data buffering, image processing and multi‑stream video applications.
Wide x16 Bus Width Configuration
256M x 16‑bit 4Gb single‑chip density helps optimize PCB routing, reduce component count and save board space.
Advanced Power & Signal Optimization
Integrates On‑Die Termination (ODT), Programmable ZQ Calibration and Dynamic ODT, improves signal integrity and reduces power consumption for high‑speed memory buses.
High Reliability & Standard FBGA Packaging
Industry‑standard 96‑ball FBGA package provides solid mechanical connection, low parasitic inductance and good thermal performance.
Key Specifications
| Brand | Nanya Technology |
|---|---|
| RoHS Status | RoHS Compliant / Lead‑Free / Halogen‑Free |
| EDA / CAD | PCB Footprint & 3D Model Available upon Request |
| Warranty | 1‑Year Standard Quality Warranty |
| Package / Case | 96‑Ball FBGA (9.00 x 13.00,0.8mm Ball pitch) |
| Mounting Type | Surface Mount Device (SMD/SMT) |
| Surface Marking / Silkscreen | NT5CB256M16DP‑EK Marking |
| Memory Type / Format | DDR3 SDRAM |
| Memory Density | 4 Gb (4 Gigabits) |
| Organization | 256M x 16‑Bit |
| Speed Grade / Frequency | DDR3‑1866 (933 MHz Clock Frequency) |
| Supply Voltage (VDD / VDDQ) | 1.5V ± 0.075V (1.425V ~ 1.575V) |
| Operating Temperature | 0°C to +95°C (Commercial Temperature) |
| Internal Banks | 8 Banks |
| Burst Length | BL8 / BC4 / BC4 (On‑the‑fly configurable) |
| Key Features | ODT, ZQ Calibration, Write‑Leveling, Self‑Refresh, Power‑Down Mode |
| Interface Standard | JEDEC DDR3 SDRAM Specification |
Typical Applications
- Networking Infrastructure (Routers, Switches, and Gateways)
- Digital Set‑Top Boxes (STB), Smart TVs, and Home Media Hubs
- Security Surveillance Cameras and Digital Video Recorders (DVR/NVR)
- Industrial Single Board Computers (SBC) and IoT Gateways
- Commercial Displays, Point of Sale (POS) Terminals, and Printers
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1‑2 business days |
| Delivery Time | 3‑7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: What does the “-EK” speed suffix mean in NT5CB256M16DP‑EK?
A: “-EK” represents DDR3‑1866 speed grade, 1866 Mbps data rate with 13‑13‑13 CAS latency timing.
Q2: What is the operating voltage required for this DRAM component?
A: NT5CB256M16DP‑EK uses standard DDR3 supply voltage: 1.5V (±0.075V), working range 1.425V‑1.575V.
Q3: How is the memory organized within the NT5CB256M16DP‑EK?
A: It is a 4Gb DDR3 chip, organized as 256M x 16‑bit with 8 internal memory banks.
Q4: What are the compatible and alternative replacement models for NT5CB256M16DP‑EK?
A: Direct pin‑to‑pin compatible alternatives: NT5CB256M16DP‑EJ (DDR3‑1600), MT41K256M16HA‑125:A (Micron). For different density, 512Mb×16 bit chips can be used for capacity expansion; note speed grade and voltage must match DDR3‑1.5V standard.
Q5: What is the difference between suffix DP, DQ, DR in Nanya DDR3 part number?
A: DP = 96‑ball FBGA package for 256M×16; DQ is for different die revision; DR indicates different power‑mode configuration. The package footprint of DP is fixed 96‑ball FBGA, do not mix‑match with other suffix packages.
Q6: Can NT5CB256M16DP‑EK work with DDR3‑1600 or DDR3‑2133 controller?
A: Yes. The chip can auto‑down‑clock to DDR3‑1600 when connected to lower‑speed memory controller. It cannot run at DDR3‑2133, maximum rated speed is 1866 Mbps.
Q7: What is the difference between commercial grade and industrial grade for this series?
A: NT5CB256M16DP‑EK is commercial grade, 0℃~95℃. Industrial grade suffix‑T:‑40℃~95℃; automotive‑H:‑40℃~105℃. Industrial version cannot be directly substituted for commercial without thermal evaluation.
Q8: How can I request datasheets, pinout details, or price quotes for NT5CB256M16DP‑EK?
A: Technical documentation, footprint data, stock availability, and volume pricing can be requested directly via our Quick Inquiry form.
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