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EP2S30F672I4N

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EP2S30F672I4N

Part NumberEP2S30F672I4N
ManufacturerIntel / Altera
CategoryIntegrated Circuits (ICs) > Embedded – FPGAs (Field Programmable Gate Array)
DescriptionStratix II FPGA, 33,888 Logic Elements, 13,552 ALMs, 500 User I/Os, 672‑FC‑FBGA Package, Industrial Grade.
Stock StatusIn Stock (Obsolete device, stock only)
OriginOriginal Factory

Product Overview

The EP2S30F672I4N is a high‑performance Stratix‑II FPGA from Intel (Altera) built on 90nm process. It adopts Adaptive Logic Module (ALM) architecture, includes 33,888 LEs,13,552 ALMs,1.36Mbit TriMatrix RAM and 16 dedicated DSP blocks. Packaged in 672‑FC‑FBGA(27×27mm), supporting 500 user I/Os, industrial temperature‑40℃~+100℃ TJ, suitable for communication and industrial signal processing systems. This component is end‑of‑life, only stock available.

Core Advantages

Innovative ALM Architecture

Patented Adaptive Logic Module improves logic utilization, efficiently handles arithmetic and complex logic functions.

TriMatrix On‑Chip Memory

Mixed M512 / M4K / M‑RAM blocks, total 1.36Mbit RAM for FIFO, dual‑port RAM and packet buffer.

Dedicated DSP Blocks

16 hardware DSP blocks, support 18×18 multiplier and MAC operation, no consume general logic resource.

Industrial‑Grade & Rich I/O Standard

‑40℃~+100℃ junction temperature; support LVDS, SSTL, HSTL, PCI‑X multi‑voltage I/O for harsh environment.

Key Specifications

BrandIntel / Altera
RoHS StatusRoHS Compliant / Lead‑Free (“N” suffix)
EDA / CADPCB Footprint & 3D Model Available upon Request
Warranty1‑Year Standard Quality Warranty
Package / Case672‑FC‑FBGA (27mm × 27mm,pitch 1.0mm)
Mounting TypeSurface Mount Device (SMD/SMT)
Surface Marking / SilkscreenEP2S30F672I4N Marking
FPGA FamilyStratix II
Equivalent Logic Elements (LEs)33,888
Adaptive Logic Modules (ALMs)13,552
Logic Array Blocks (LABs)1694 LABs
Total Embedded RAM~1.36 Mbits (1,369,728 bits)
Embedded DSP Blocks16 Blocks (Up to 64 18×18 Multipliers)
Number of User I/Os500 I/O Pins
Core Voltage (Vccint)1.2 V Nominal (1.15V‑1.25V allowable)
Speed Grade‑4
Max Clock Frequency717 MHz (‑4 speed grade)
Operating Junction Temperature‑40°C to +100°C (TJ)
Software SupportQuartus II 7.1 ~ Quartus II 13.0 only
Lifecycle StatusObsolete / End‑of‑Life, only stock supply

Typical Applications

  • Telecommunication Infrastructure & Wireless Base Station Baseband Processing
  • High‑Speed Network Routers, Switches, and Data Packet Processing Systems
  • Digital Signal Processing (DSP) & High‑Resolution Video Broadcast Equipment
  • Industrial Automation, Robotics Control, and High‑Speed Test & Measurement
  • Medical Imaging, Diagnostic Radar, and Military/Aerospace Embedded Avionics

Order & Shipping Info

Minimum Order Quantity (MOQ)1 Piece
Shipping TimeShipped within 1‑2 business days
Delivery Time3‑7 working days worldwide
Shipping MethodsDHL, UPS, FedEx, EMS
Payment MethodsT/T (Bank Transfer), PayPal, Credit Card, Western Union

Technical Support

For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.

Frequently Asked Questions

Q1: What does suffix F672‑I4N mean for EP2S30F672I4N?

A: F672 = 672‑pin FC‑FBGA package;I = industrial temperature grade(-40℃~+100℃ TJ);4 = speed grade‑4;N = lead‑free RoHS compliant.

Q2: Difference between C (commercial) and I (industrial) suffix?

A: C suffix: commercial grade 0℃~+85℃ junction temperature. I suffix: industrial grade -40℃~+100℃ junction temperature. Pin‑to‑pin compatible, temperature rating differs.

Q3: Can EP2S30F672I4N directly replace EP2S60F672I4N?

A: Same 672‑FC‑FBGA footprint, pin compatible. EP2S60 provides larger logic, RAM and DSP resources. Project recompilation & timing verification required, not drop‑in replacement.

Q4: Which Quartus II version supports EP2S30F672I4N?

A: Only Quartus II 7.1 ~ 13.0. Newer software versions drop Stratix‑II device support.

Q5: Is EP2S30F672I4N interchangeable with EP2C30 series?

A: Not interchangeable. EP2S belongs to Stratix‑II with ALM architecture; EP2C is Cyclone‑II. Different architecture, resources and timing parameters.

Q6: Are there pin‑to‑pin alternatives for obsolete EP2S30F672I4N?

A: No direct pin‑compatible replacement. Migration options: Stratix‑III / Cyclone‑IV GX. Requires PCB redesign and firmware redevelopment.

Q7: What is the package dimension of EP2S30F672I4N?

A: 672‑FC‑FBGA, body size 27mm × 27mm, ball pitch 1.0mm.

Q8: How to get datasheet and pin‑out document?

A: Submit product inquiry for Stratix‑II handbook, BGA pin‑map and stock quotation.

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