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A2F200M3F-FGG256I
A2F200M3F-FGG256I
| Part Number | A2F200M3F-FGG256I |
|---|---|
| Manufacturer | Microchip Technology (formerly Microsemi / Actel) |
| Category | Integrated Circuits (ICs) > Programmable Logic Devices > FPGA / cSoC |
| Description | SmartFusion customizable System-on-Chip (cSoC) with 200K gate flash FPGA logic, 80MHz nominal ARM Cortex-M3 MCU subsystem, integrated analog monitoring, hardware watchdog, internal temperature sensor and AES encryption, industrial FBGA-256 package. |
| Stock Status | In Stock |
| Origin | Original Factory Sealed Tray Packaging |
Product Overview
A2F200M3F-FGG256I is Microchip SmartFusion cSoC. It integrates flash FPGA fabric, hardened Cortex-M3 MCU and programmable analog modules on a single chip. Equipped with 200K equivalent logic gates, it connects to the processor via AMBA bus for custom hardware and peripheral design. Flash configuration removes external memory and enables instant power-on. Built-in temperature sensor, watchdog timer and AES engine support stable long-term operation for industrial control, power monitoring and secure embedded devices.
Core Advantages
Single-Chip Integrated Architecture
Combines ARM Cortex-M3 processor, 200K flash FPGA logic and multi-channel analog circuits in one component, reduces PCB layout area and simplifies hardware verification.
Flash Non-Volatile & Instant-On Feature
On-chip flash storage holds configuration data without external PROM, supports fast power-up initialization and avoids radiation-induced configuration corruption.
Built-In System Monitoring Modules
Integrated internal temperature sensor, hardware watchdog timer and multi-range voltage monitoring circuits for real-time hardware fault detection.
Hardware AES Security Engine
Native AES encryption block supports firmware protection and secure data transmission for industrial and communication devices.
Low Static Power Consumption
Lower standby power than comparable SRAM FPGA solutions, multiple sleep modes available for battery-powered embedded equipment.
Key Specifications
| Brand & Family | Microchip Technology / SmartFusion® cSoC Family |
|---|---|
| RoHS Compliance | RoHS Compliant, Lead-Free, Halogen-Free Construction |
| EDA/CAD Resources | 3D STEP Models, Schematic Symbols, PCB Footprints available on request |
| Quality Warranty | 1-Year Standard Factory Quality Warranty |
| Package / Case | FBGA-256 (17mm × 17mm) |
| Mounting Technology | Surface Mount Device (SMD / SMT) |
| Package Silkscreen Marking | A2F200M3F FGG256 Marking |
| Processor Core | ARM® Cortex®-M3 Hard 32-Bit RISC Processor Core |
| Processor Operating Frequency | 80 MHz Nominal Clock, Up to 100 MHz Maximum Operating Clock |
| FPGA Logic Resource | 200,000 Equivalent System Gates, 4,608 D-type Tile Logic Cells |
| MSS Internal Flash Memory | 256 KB Non-Volatile Program Storage |
| MSS Internal SRAM Memory | 64 KB Zero-Wait-State Execution SRAM |
| Analog Subsystem Features | 12-Bit Multi-Channel ADC, 12-Bit DAC, Multi-Range Analog Comparators, Internal Temperature Sensor |
| Security Hardware Module | Built-In AES Encryption Engine, Hardware Watchdog Timer for System Fault Recovery |
| User I/O Pins (FBGA256 Package) | Up to 66 shared digital & analog multiplexed user I/O pins |
| Supported Debug Interfaces | 4-Wire JTAG Debug, 2-Wire Serial Wire Debug (SWD), Single Wire Viewer |
| Nominal Supply Voltage | 1.2V Core Logic, 2.5V / 3.3V I/O Interface Power Supply |
| Industrial Operating Temperature | -40°C to +85°C Industrial Temperature Grade |
| Maximum Junction Temperature | 100°C Maximum Continuous Junction Temperature |
| Standard Packaging Form | Anti-Static Plastic BGA Tray, Original Factory Sealed Packing |
Typical Applications
- Industrial automation PLC, multi-axis motion control and remote IO modules
- Power system monitoring: voltage sequence control, thermal protection and hardware fault detection
- Smart energy meters, solar power inverters and grid monitoring terminal equipment
- Medical signal acquisition, precision laboratory measuring instruments
- Secure communication nodes, aerospace telemetry and radiation-resistant embedded control boards
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Processing Lead Time | Ship within 1-2 business days after payment confirmation |
| Global Delivery Cycle | 3-7 working days worldwide via express courier |
| Available Shipping Carriers | DHL, UPS, FedEx, EMS International Express |
| Accepted Payment Methods | T/T Wire Transfer, PayPal, Credit Card, Western Union |
Technical Support
Submit product inquiry to obtain official datasheets, sample supply, bulk quotation and design technical support. Engineering team will reply within 24 working hours.
Frequently Asked Questions
Q1: Are stocked A2F200M3F-FGG256I chips brand new original?
A: All inventory units are original factory new Microchip components, packed in anti-static BGA trays. Full batch inspection is completed before shipment to guarantee pin integrity and electrical performance.
Q2: What is the definition of cSoC for SmartFusion series chips?
A: cSoC stands for customizable System-on-Chip. It integrates fixed Cortex-M3 hard processor, dedicated analog monitoring circuits and programmable FPGA logic on a single die, avoiding timing risks of soft processor cores inside FPGA fabric.
Q3: Does flash architecture resist single-event upset (SEU) radiation interference?
A: Yes. SRAM FPGAs store routing data in volatile memory and are vulnerable to radiation corruption. Flash configuration retains data permanently without refresh, improving reliability for high-altitude and industrial environments.
Q4: How to download official datasheet and get bulk pricing quotation?
A: Fill the online inquiry form on product page. Our engineering team will send complete datasheet, design reference materials and large-volume price offer within 24 hours.
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