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BLF6G10LS-200RN

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BLF6G10LS-200RN

Part NumberBLF6G10LS-200RN
ManufacturerAmpleon / NXP Semiconductors
CategoryDiscrete Semiconductor Products > Transistors > FETs, MOSFETs > RF MOSFETs
Description200W LDMOS RF Power Transistor, 700MHz to 1000MHz Frequency Range, 28V Drain Operation, Earless Flanged SOT502B Package.
Stock StatusIn Stock
OriginOriginal Factory

Product Overview

BLF6G10LS-200RN is a 200W high-power LDMOS transistor from Ampleon (formerly NXP), designed for base station and industrial RF applications covering 700MHz~1000MHz. Operated at 28V DC, this power FET features built-in input matching and strong load mismatch robustness. Housed in earless ceramic air-cavity SOT502B package, it is widely used for GSM, EDGE, W-CDMA, LTE multi-carrier communication equipment.

Core Advantages

200W Peak Output Power

Delivers up to 200W peak RF power at 28V, ideal for high-capacity telecom power amplifier systems.

700MHz~1000MHz Wide Frequency Band

Supports cellular communication bands and industrial ISM frequency applications.

Integrated Input Matching

On-chip matching circuit reduces peripheral components and simplifies PCB layout design.

Earless SOT502B Package & High Ruggedness

Earless flanged ceramic package, withstands VSWR up to 10:1 across all phases with low thermal resistance.

Key Specifications

BrandAmpleon / NXP Semiconductors
RoHS StatusRoHS Compliant / Lead-Free / Green
EDA/CADSymbol, Footprint & 3D Model Available
Warranty1-Year Standard Quality Warranty
Package / CaseSOT502B (Earless Flanged Ceramic Air-Cavity Package)
Mounting TypeChassis Mount / Flange Mount
Surface Marking / SilkscreenBLF6G10LS-200RN Marking
Transistor TechnologyLDMOS (Lateral Diffused Metal Oxide Semiconductor)
Frequency Band700 MHz to 1000 MHz
Output Power (P1dB)200 W (Peak capability at 28V)
Average Output Power(W-CDMA,2-carrier)40 W @ 869–894 MHz
Power Gain (Gp)20 dB (Typical)
Drain Efficiency (ηD)28.5% (Typical under W-CDMA signal)
ACPR-39 dBc (3GPP Test Model)
Operating Drain Voltage (VDS)28 V (Nominal), Absolute Maximum 65V
Quiescent Drain Current (IDQ)1400 mA (Typical)
Thermal Resistance (Rth(j-case))0.35 K/W
Load Mismatch RuggednessVSWR = 10:1 through all phases
Operating Junction TemperatureUp to +225°C
Storage Temperature (Tstg)-65°C ~ +150°C
Packaging FormatTray / Tube

Typical Applications

  • Cellular base station power amplifiers for GSM, EDGE, W-CDMA, and LTE sub-GHz networks
  • High-power macro-cell and micro-cell telecom transmitter output stages
  • Industrial, Scientific, and Medical (ISM) RF generators operating in 868MHz and 915MHz bands
  • Public safety communication systems, trunked radios, and terrestrial repeaters
  • Broadcasting transmitters and laboratory RF power amplification equipment

Order & Shipping Info

Minimum Order Quantity (MOQ)1 Piece
Shipping TimeShipped within 1-2 business days
Delivery Time3-7 working days worldwide
Shipping MethodsDHL, UPS, FedEx, EMS
Payment MethodsT/T (Bank Transfer), PayPal, Credit Card, Western Union

Technical Support

For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.

Frequently Asked Questions

Q1: What is the main difference between BLF6G10LS-200RN and BLF6G10LS-13SR?

A: BLF6G10LS-200RN supports peak output power 200W; BLF6G10LS-13SR is 135W. The 200RN variant adopts earless SOT502B ceramic package with lower thermal resistance.

Q2: What frequency band is BLF6G10LS-200RN designed for?

A: Optimized for 700MHz ~ 1000MHz, covers mainstream cellular bands and ISM frequency range.

Q3: Does BLF6G10LS-200RN have built-in impedance matching?

A: Yes, internal input matching is integrated, simplifying PCB circuit design and reducing peripheral components.

Q4: How to install the device to achieve optimal heat dissipation?

A: Mount the SOT502B base flat on heatsink. Use thermal interface material or soldering to minimize thermal resistance.

Q5: What is the operating supply voltage of this transistor?

A: Nominal working voltage 28V, absolute maximum drain voltage 65V.

Q6: What are typical alternative / compatible models?

A: Alternative options: BLF6G10-200RN (with flange version), BLF6G10LS-13SR (lower power). Package and circuit need re-verification when replacing.

Q7: What communication standards can this LDMOS support?

A: Suitable for GSM, EDGE, W-CDMA, LTE multi-carrier base station and industrial RF amplifier equipment.

Q8: How rugged is BLF6G10LS-200RN under load mismatch?

A: It can endure VSWR up to 10:1 across all phases, strong anti-reflection performance for transmitter applications.

Q9: What is the difference between BLF6G10LS-200RN and BLF6G10LS-200RN:11?

A: They are the same device. The suffix :11 is only the distributor inventory coding mark, there is no difference in electrical parameters, package and performance. It can be used interchangeably.

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