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BLF8G20LS-220

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BLF8G20LS-220

Part NumberBLF8G20LS-220
ManufacturerAmpleon / NXP Semiconductors
CategoryDiscrete Semiconductor Products > Transistors – FETs, MOSFETs – RF
DescriptionPower LDMOS Transistor, 220W Peak (Modulated); 55W Average, 1800 MHz to 2000 MHz, 28V, SOT502B Package.
Stock StatusIn Stock
OriginOriginal Factory

Product Overview

The BLF8G20LS‑220 is a high‑power Gen8 LDMOS RF transistor from Ampleon (formerly NXP). Operating from 1800 MHz to 2000 MHz, it delivers 220 W peak output power under modulated signals at 28 V supply, with 55 W average power for LTE/W‑CDMA base‑station amplifiers. It comes in a low‑thermal‑resistance earless ceramic SOT502B package, offering high gain, good efficiency and strong load‑mismatch ruggedness for wireless infrastructure.

Core Advantages

High Efficiency & Superior Power Gain

Built on Ampleon Gen8 LDMOS technology, it delivers high PAE and power gain to lower power consumption and thermal load.

Integrated Internal Matching

Built‑in input/output matching networks simplify PCB layout and reduce external discrete components.

High Ruggedness & Reliability

Withstands 10:1 VSWR load mismatch across all phases, ensuring stable long‑term operation in base‑station systems.

Optimized Thermal Management

Earless ceramic SOT502B package features low thermal resistance for direct heatsink mounting and effective heat dissipation.

Key Specifications

BrandAmpleon / NXP Semiconductors
RoHS StatusRoHS Compliant / Lead-Free
EDA / CADPCB Footprint & 3D Model Available upon Request
Warranty1-Year Standard Quality Warranty
Package / CaseSOT502B (Earless Ceramic Flange)
Mounting TypeChassis Mount / Flange Mount
Surface Marking / SilkscreenBLF8G20LS-220 Marking
Transistor TypeLDMOS N-Channel RF Power Transistor
Operating Frequency Range1800 MHz to 2000 MHz
Output Power (Pout)220 W Peak (Modulated); 55 W Average (W‑CDMA)
Drain-Source Voltage (Vds)28 V DC Typ. (Max 65V Vdss)
Power Gain (Gps)> 18 dB Typ. @ 1805 MHz
Drain Efficiency34% Typ. (W‑CDMA modulated); >50% (CW condition)
Quiescent Drain Current (IDQ)1600 mA (Typ. @ Vds=28V)
Junction Temperature (TJ)225 °C (Max)
Storage Temperature-65 °C ~ +150 °C
Thermal Resistance Rth(j‑c)0.27 K/W
Reference Case Temperature80 °C
VSWR Ruggedness10:1 across all phase angles (Class‑AB operation)
Pin Assignment1‑Drain, 2‑Gate, 3‑Source (Source connected to flange)

Typical Applications

  • LTE, W-CDMA, and GSM/EDGE Wireless Base Station Power Amplifiers (1.8 GHz – 2.0 GHz Band)
  • Macrocell Base Station Multi-Carrier Power Amplifiers (MCPA)
  • Cellular Repeater Systems and Small Cell Transmission Nodes
  • Industrial, Scientific, and Medical (ISM) RF Power Amplifiers
  • Wireless Infrastructure Transmitters and Repeater Systems

Order & Shipping Info

Minimum Order Quantity (MOQ)1 Piece
Shipping TimeShipped within 1-2 business days
Delivery Time3-7 working days worldwide
Shipping MethodsDHL, UPS, FedEx, EMS
Payment MethodsT/T (Bank Transfer), PayPal, Credit Card, Western Union

Technical Support

For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.

Frequently Asked Questions

Q1: What operating frequency range is supported by the BLF8G20LS‑220?

A: Optimized for base‑station applications, it operates within 1800 MHz‑2000 MHz.

Q2: What package type does the BLF8G20LS‑220 use?

A: Earless ceramic SOT502B package for high‑power RF performance.

Q3: Does the BLF8G20LS‑220 feature internal matching?

A: Yes. Integrated input & output matching networks simplify circuit design and impedance matching.

Q4: What are pin‑compatible replacement models for BLF8G20LS‑220?

A: BLF8G20LS‑250 is pin‑compatible with same SOT502B footprint, higher 250 W CW output power. It can be a drop‑in upgrade, but bias and matching networks need adjustment for best performance.
BLF8G10LS‑270 is NOT a direct substitute. It is tuned for 820‑960 MHz, frequency mismatch will cause severe gain and efficiency loss.

Q5: What is typical IDQ quiescent drain current for BLF8G20LS‑220?

A: Typical IDQ = 1600 mA at Vds=28 V for Class‑AB bias. Wrong bias settings will reduce efficiency or damage the transistor.

Q6: What is the VSWR ruggedness specification of BLF8G20LS‑220?

A: Under Class‑AB operation, it withstands 10:1 VSWR across all phase angles, critical for base‑station amplifier reliability.

Q7: What is the difference between BLF8G20LS‑220 and BLF8G20LS‑250?

A: Both share SOT502B package, pinout, frequency band and Gen8 LDMOS technology.
‑ BLF8G20LS‑220: 220 W CW output power.
‑ BLF8G20LS‑250: 250 W CW output power, requires enhanced heatsink capacity.

Q8: What is the difference between BLF8G20LS‑220, BLF8G20LS‑220J and BLF8G20LS‑220U?

A: These three share identical die, electrical specs, SOT502B package and pin‑out, fully drop‑in compatible.
‑ BLF8G20LS‑220: Original base part number from datasheet.
‑ BLF8G20LS‑220J: Old NXP OPN, tape‑and‑reel packaging, obsolete / discontinued.
‑ BLF8G20LS‑220U: Current Ampleon OPN, tube/tray packaging, mainstream supply version.
Only packaging differs; no change to RF performance.

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