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EP3SE110F1152I3N
EP3SE110F1152I3N
| Part Number | EP3SE110F1152I3N |
|---|---|
| Manufacturer | Intel® FPGAs (Formerly Altera) |
| Category | Integrated Circuits (ICs) > Embedded – FPGAs (Field Programmable Gate Array) |
| Description | low-power Stratix III E family FPGA, featuring 107,500 Logic Elements (LEs), 8,436 Kb embedded memory, and 744 user I/Os, housed in a 1152-pin FineLine BGA package for advanced industrial and high-bandwidth networking applications. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The EP3SE110F1152I3N is Intel (formerly Altera) Stratix III E industrial FPGA, built on 65nm power-saving process. It integrates 107,500 LEs, 8,436 Kb embedded RAM and 576 DSP blocks, delivering powerful parallel computing and signal processing capacity. Its unique programmable power technology cuts static power and thermal load without sacrificing timing performance. Packaged in 1152-pin 35×35mm FBGA with 744 multi-standard I/Os, this -40℃~+105℃ industrial-grade chip fits telecom base stations, medical imaging, aerospace SDR, machine vision and high-density embedded systems.
Core Advantages
Intellectual Programmable Power Matrix
Utilizes advanced internal architectural switching that minimizes leakage and dynamically cuts static power usage across non-critical logic arrays, significantly reducing overall thermal dissipation requirements.
Massive Internal Memory & DSP Densities
Integrates robust blocks of high-performance TriMatrix embedded RAM alongside high-precision dedicated DSP multipliers, making it perfect for rapid finite impulse response (FIR) filtering and digital up/down-conversions.
High-Bandwidth Multi-Standard I/O Connectivity
Provides 744 rugged user-assignable I/O pins supporting various single-ended and differential signaling standards (such as LVDS and differential HSTL), interfacing smoothly with modern memory buses.
Extended Industrial Grade Thermal Resilience
Certified to sustain prolonged operational reliability under severe environmental temperature gradients ranging from -40°C up to +105°C junction temperature, offering reliable security for rugged edge gateways.
Key Specifications
| Brand | Intel® / Altera Stratix® III High-End FPGA Family Series |
|---|---|
| RoHS Status | RoHS Compliant / Lead-Free (Standard “N” Suffix Matte-Tin Finish Verified) |
| EDA/CAD Model | 3D STEP Models, Schematic Symbols, and PCB footprints available upon request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 1152-BBGA / FBGA (35mm × 35mm × 1.0mm) |
| Mounting Type | Surface Mount Technology (SMD/SMT BGA Reflow Soldering) |
| Surface Marking / Silkscreen | EP3SE110F1152I3N Marking |
| Logic Elements (LEs) Count | 107,500 Logic Elements (Approximating 43,000 Equivalent Logic Array Blocks – LABs) |
| Total Embedded RAM Capacity | 8,436 Kb (Combines flexible M9K memory blocks and massive M-RAM arrays) |
| Dedicated DSP Multipliers | 576 dedicated 18×18 DSP multipliers, configurable as dual 9×9 multipliers for low-precision arithmetic tasks |
| Number of User I/O Pins | 744 Available User I/O Pins (Equipped with integrated source-synchronous dynamic alignment) |
| Core Operational Supply Voltage | Standard low-voltage core operation: 0.9V nominal |
| Speed Grade Performance Index | Index 3 Speed Grade Rating (Indicating fast logic execution timing profiles) |
| Operating Temperature Range | -40°C to +105°C Junction Temperature (Extended Industrial Operational Boundaries) |
| Differential I/O Standards Supported | LVDS, LVPECL, Differential HSTL, SSTL, RSDS, Mini-LVDS high-speed differential signaling |
| Internal PLL Quantity | Up to 24 independent clock management PLLs for multi-domain timing synchronization |
| On-Chip Configuration Memory | Embedded Flash memory supporting serial/parallel active configuration modes |
| I/O Input Tolerance Voltage | 3.3V, 2.5V, 1.8V, 1.5V, 1.2V multi-voltage I/O bank tolerance support |
| High-Speed Transceiver Note | No embedded multi-gigabit SERDES transceivers (Stratix III E series logic-optimized architecture) |
| Moisture Sensitivity Level | MSL 3 (168 hours floor life under 30°C / 60% RH per JEDEC standard) |
Typical Applications
- Advanced High-Bandwidth Telecommunications Infrastructure, Wireless Basestations, and LTE Network Routers
- High-Resolution Medical Diagnostic Equipment, Ultrasonic Imaging Engines, and Real-Time MRI Data Processing
- Military Radar Processing Subsystems, Precision Aerospace Telemetry, and Rugged Software-Defined Radios (SDR)
- Broadcast Video Studio Equipment, Real-Time 4K Video Encoding/Decoding Matrices, and Image Processing Hubs
- High-Performance Industrial Automation Controls, Complex Robotic Motion Planning, and Machine Vision Nodes
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: Is your currently available inventory of the EP3SE110F1152I3N 100% genuine and original?
A: Yes, we guarantee that all EP3SE110F1152I3N FPGAs in our stock are 100% brand-new, factory-original parts directly from Intel / Altera. Every production batch undergoes strict incoming quality tracking inspections and is shipped in sealed, moisture-barrier JEDEC matrix trays to keep the high-density BGA solder spheres perfectly flat and clean.
Q2: What is the main design difference between the Altera Stratix III “E” variant and the “L” or “GX” variants?
A: The Stratix III “E” (Enhanced Logic) family is intentionally optimized for logic-heavy, memory-intensive computational processing applications. While the “GX” family includes dedicated high-speed multi-gigabit serial transceivers, the “E” family concentrates its layout on packing maximum logic array blocks, embedded RAM bits, and user I/Os for highly parallel data structures.
Q3: What does the “N” suffix at the end of the EP3SE110F1152I3N part number indicate?
A: The trailing letter “N” signifies that the device is manufactured with a fully lead-free, RoHS-compliant package finish configuration. This specification uses matte-tin solder bumps on the BGA matrix, matching standard lead-free eco-assembly guidelines and reflow temperature profiles perfectly.
Q4: How can our physical engineering group secure the Pin-Out map data or request a large volume price breakdown?
A: Please enter your precise project metrics and target purchase volume into our Quick Inquiry web form found on this product page. Our dedicated embedded interface technical support desk will review your details and respond with official data assets and customized tier-pricing brackets within 24 hours.
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