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GK7205RNCFV200
GK7205RNCFV200
| Part Number | GK7205RNCFV200 |
|---|---|
| Manufacturer | Goke Microelectronics |
| Category | Integrated Circuits (ICs) > Embedded Processors, System‑on‑Chip (SoC) |
| Description | Low‑Power Smart IP Camera SoC, ARM Cortex‑A7 Engine, Built‑in NPU, H.264/H.265 Video Encoder, QFN‑88 Package, Requires External DDR2/DDR3 Memory. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
GK7205RNCFV200 is a low‑power SoC from Goke Microelectronics for smart IP cameras and edge‑AI vision terminals. It integrates ARM Cortex‑A7 CPU, NPU, high‑performance ISP and H.264/H.265 multi‑stream encoder. This RNCF variant has no on‑chip memory and requires external DDR2/DDR3. Ideal for cost‑sensitive surveillance cameras, video doorbells and AI vision devices.
Core Advantages
Edge‑AI NPU Accelerator
Built‑in NPU runs human, face and vehicle detection algorithms with low latency for edge vision applications.
Flexible External DDR Design
No on‑chip memory. Select external DDR2/DDR3 capacity per project requirements to optimize BOM cost.
High‑Performance ISP
Supports 3DNR, WDR and low‑light enhancement, delivering clean output for 3‑MP image sensors.
Efficient Video Encoding
H.265 / H.264 / MJPEG multi‑stream encoder reduces bandwidth and storage consumption without quality loss.
Key Specifications
| Brand | Goke |
|---|---|
| RoHS Status | RoHS Compliant / Lead‑Free |
| EDA / CAD | PCB Footprint & 3D Model Available upon Request |
| Warranty | 1‑Year Standard Quality Warranty |
| Package / Case | QFN‑88 |
| Mounting Type | Surface Mount (SMD / SMT) |
| Surface Marking / Silkscreen | GK7205RNCFV200 / Goke Logo |
| CPU Core | ARM Cortex‑A7 Single‑Core Processor |
| CPU Frequency | 900MHz |
| Embedded Memory | No on‑chip memory, requires external DDR2 / DDR3 |
| Max Encoding Resolution | 3MP (2304 × 1296) @30 fps |
| Video Codecs | H.265 / H.264 / MJPEG Encoding Engine |
| Sensor Input Interface | MIPI CSI‑2 / DVP / LVDS / HiSPI |
| Audio Support | G.711, G.726, ADPCM, 3A audio (AEC/ANR/AGC) |
| Peripheral Interfaces | Ethernet MAC, USB 2.0 Host/Device, SDIO2.0, UART, SPI, I2C, PWM, GPIO |
| Operating Temperature Range | -20°C to +70°C |
Typical Applications
- Smart Home IP Cameras, Low‑cost Battery‑Powered Cameras, Video Doorbells
- 3MP Security Surveillance and Commercial AI Network Cameras
- AI Edge Vision Terminals, Human Detection and Access Control Terminals
- UVC USB Cameras, Webcams and Video Conference Equipment
- Micro Industrial Vision Cameras and IoT Visual Sensing Modules
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1‑2 business days |
| Delivery Time | 3‑7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, SDK, sample requests, stock check or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: What are the main features of GK7205RNCFV200 SoC?
A: It integrates ARM Cortex‑A7 CPU, AI NPU, ISP and H.264/H.265 3MP video encoder. This variant requires external DDR2/DDR3 memory, packaged in QFN‑88.
Q2: Does GK7205RNCFV200 include on‑chip DDR memory?
A: No. This chip has no built‑in memory, external DDR2 or DDR3 must be populated on PCB. Do not confuse with GK7205V200 which integrates on‑chip DDR.
Q3: What is the difference between GK7205RNCFV200 and GK7205V200?
A: Both use QFN‑88 package. GK7205V200 has integrated on‑chip DDR for simpler PCB layout. GK7205RNCFV200 needs external DDR for lower chip cost. They are NOT pin‑to‑pin compatible.
Q4: What sensor interfaces are supported?
A: MIPI CSI‑2, DVP, LVDS and HiSPI interfaces for various CMOS image sensors.
Q5: What are functional alternative chips?
A: Functional alternative: Hi3516ERNCV200. For higher resolution, choose GK7205V300. No direct pin‑compatible replacement; hardware circuit and SDK firmware changes are required.
Q6: Important hardware design tips?
A: Follow correct power‑on sequence. Select matching DDR2/DDR3 for your workload. Ensure thermal cooling for continuous AI tasks. Use the official matched SDK version.
Q7: How to get datasheet, SDK and bulk price?
A: Submit quick inquiry for datasheet, SDK documents, sample chips and volume quotation.
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