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IS61NLP51236-200B3LI-TR
IS61NLP51236-200B3LI-TR
| Part Number | IS61NLP51236-200B3LI-TR |
|---|---|
| Manufacturer | Integrated Silicon Solution Inc. (ISSI) |
| Category | Integrated Circuits (ICs) > Memory > SRAM – Synchronous |
| Description | 18Mb (512K × 36) High-Speed Synchronous No Bus Latency (NBL/NoBL) Pipeline SRAM, 200MHz, 3.3V, Industrial Grade, Tape & Reel, 165-TFBGA Package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The IS61NLP51236-200B3LI-TR is a 18Mb high-speed synchronous SRAM from ISSI, structured as 512K × 36 bits. Its NBL pipelined architecture eliminates idle bus cycles between read and write operations to maximize bandwidth. Operating at 200 MHz with 3.1 ns access time, it delivers high throughput for network equipment, telecom infrastructure and real-time DSP systems. Powered by 3.3V core voltage with selectable 2.5V/3.3V I/O rails, this industrial-grade chip works from -40°C to +85°C. Packaged in 165-TFBGA and supplied in tape & reel, it balances high performance, temperature durability and easy SMT assembly.
Core Advantages
No Bus Latency (NBL) Pipelined Architecture
Supports continuous read-write switching without wait cycles, maximizing bandwidth efficiency for high-frequency data exchange.
200 MHz Ultra-Low Latency Performance
200 MHz maximum clock frequency and 3.1 ns access time, ideal for timing-sensitive embedded packet buffering and instruction fetching.
36-bit Wide Data Bus
32 data bits plus 4 parity bits, enabling FPGAs and microprocessors to implement real-time error detection while maintaining complete data alignment.
Industrial-Grade Compact BGA Package
Rated for -40°C ~ +85°C wide industrial temperature range; high-density 165-TFBGA housing offers reliable thermal and mechanical stability for harsh working environments.
Key Specifications
| Brand | ISSI High-Speed Synchronous SRAM Series |
|---|---|
| RoHS Status | RoHS3 Compliant / Lead-Free / Green Package |
| MSL Rating | MSL 3 (168 Hours Floor Life) |
| REACH Compliance | REACH Unaffected, No SVHC Substances |
| ECCN Code | 3A991B2A |
| EDA/CAD Model | Schematic symbols, 3D CAD step profiles, and 165-TFBGA footprint land patterns are available on request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 165-TFBGA (13.00 mm × 15.00 mm) |
| Mounting Type | Surface Mount (SMT / SMD) |
| Packaging Standard | Tape & Reel (-TR Suffix for automated high-speed SMT assembly) |
| Surface Marking / Silkscreen | IS61NLP51236-200B3LI / ISSI logo Marking |
| Memory Architecture | Synchronous Pipelined NBL (No Bus Latency) SRAM |
| Density & Configuration | 18 Mb (Organized as 512K words × 36 bits / 524,288 × 36) |
| Max Operating Frequency | 200 MHz |
| Clock Access Time (tKQ) | 3.1 ns Maximum |
| Core Supply Voltage (VDD) | 3.3V ± 5% (3.135V ~ 3.465V) |
| I/O Supply Voltage (VDDQ) | 2.5V or 3.3V Programmable Interface Rail |
| Operating Temperature Range | -40°C to +85°C (Industrial Grade Specification) |
| Data I/O Level Support | 2.5V / 3.3V dual voltage compatible, configurable via hardware pin |
| Read/Write Turnaround | No bus idle cycles, zero wait-state read-write switching |
| Data Bus Width | 36-bit (32 data bits + 4 parity check bits) |
| Refresh Requirement | No auto-refresh needed, static memory architecture |
| Operating Supply Current (IDD) | 320mA typical at full 200MHz continuous operation |
| Standby Current (ISB) | 18mA typical static standby power consumption |
| Pin Count | 165 pins full array ball grid layout |
| End of Life Status | Discontinued / EOL, limited stock available, compatible replacement series supported |
Typical Applications
- High-speed enterprise networking routers, core Ethernet switches, and optical transport equipment
- Cellular base stations, wireless infrastructure control cards, and software-defined radios (SDR)
- High-performance digital signal processing (DSP) arrays, radar signal analyzers, and imaging engines
- Test and measurement instrumentation, digital storage oscilloscopes, and automated test equipment (ATE)
- Industrial automation controllers, high-speed frame buffers, and embedded computing systems
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: What do the suffix “-200B3LI-TR” mean in IS61NLP51236 model?
A: -200 = 200 MHz rated clock frequency; B3 = 165-TFBGA package (13mm × 15mm); L = RoHS lead-free; I = industrial temperature range (-40℃~+85℃); TR = tape & reel packing.
Q2: How does NBL (No Bus Latency) improve performance vs regular synchronous SRAM?
A: Common SRAMs need idle bus cycles when switching read/write directions. NBL architecture supports continuous back-to-back read/write operations with zero wait cycles, achieving 100% bus utilization during data transmission.
Q3: What benefits does 36-bit bus bring to FPGA & MCU design?
A: It includes 32 main data bits plus 4 parity/ECC bits, supporting real-time error correction to secure data transmission for network and industrial control equipment.
Q4: Can I run I/O at 2.5V while core circuit runs 3.3V?
A: Yes. This chip separates VDD (core power) and VDDQ (I/O power). VDD must keep 3.3V for stable high-speed timing, while VDDQ can connect to 2.5V or 3.3V to match low-voltage FPGAs and processors.
Q5: Is IS61NLP51236 still in mass production?
A: This model is EOL (End of Life). We hold limited original factory stock, and we can provide compatible replacement SRAM models with identical pin definition and performance.
Q6: What is the storage shelf life for unopened tape & reel stock?
A: Unsealed original reel can be stored for 1 year under standard warehouse temperature; once opened, finish SMT mounting within 168 hours to meet MSL3 moisture resistance requirements.
Q7: What reflow soldering temperature is suitable for 165-TFBGA package?
A: Follow JEDEC standard reflow profile, peak temperature shall not exceed 260℃, total high-temperature duration under 60 seconds to avoid package deformation.
Q8: What is the lead time for bulk orders?
A: For in-stock items, we arrange shipment within 1-3 working days. For out-of-stock EOL parts, delivery cycle depends on remaining factory inventory, our sales will confirm exact schedule for you.
Q9: Can this SRAM work with other brand FPGAs besides ISSI reference design?
A: Fully compatible with mainstream FPGA brands including Xilinx, Intel Altera, Microchip, as long as the bus timing parameter matches the 200MHz operating specification.
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