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SAL-TC277TP-64F200N DC

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SAL-TC277TP-64F200N DC

Part NumberSAL-TC277TP-64F200N DC
ManufacturerInfineon Technologies
CategoryIntegrated Circuits (ICs) > Embedded – Microcontrollers
Description32-Bit TriCore AURIX TC27x Microcontroller, Triple Core, 200MHz, 4MB Flash, Extended Temp Automotive Grade (-40°C to +150°C), LFBGA-292 Package.
Stock StatusIn Stock
OriginOriginal Factory

Product Overview

The SAL‑TC277TP‑64F200N DC is an Infineon AURIX™ TC27x 32‑bit automotive MCU. Featuring triple‑core TriCore™ v1.6.1 @200 MHz, 4 MB ECC Flash, 472 KB SRAM and 64 KB emulated EEPROM. Rated for ‑40℃~+150℃ junction temperature, it complies with ISO 26262 ASIL‑D / SIL‑3, integrates lockstep cores, HSM, FPU, 64‑channel DMA and rich automotive peripherals. Packaged in PG‑LFBGA‑292, it targets powertrain, transmission, chassis and high‑reliability ADAS applications.

Core Advantages

Triple‑Core TriCore™ Architecture

Three 32‑bit TriCore™ cores up to 200 MHz; dual‑core lockstep for safety, with DSP & FPU for complex real‑time control tasks.

Extended High‑Temperature Grade

SAL grade supports ‑40℃~+150℃ junction temperature, ideal for under‑hood and harsh automotive environments.

ISO 26262 ASIL‑D / SIL‑3 Safety

Built‑in lockstep cores, SMU, MPU, ECC memory and hardware watchdog to meet strict automotive safety standards.

Rich Automotive Interfaces

Supports CAN‑FD, FlexRay, 100‑Mbit Ethernet, LIN, QSPI and multi‑protocol serial interfaces for vehicle network communication.

Key Specifications

BrandInfineon Technologies
RoHS StatusRoHS Compliant / Lead‑Free
EDA / CADPCB Footprint & 3D Model Available upon Request
Warranty1‑Year Standard Quality Warranty
Package / CasePG‑LFBGA‑292 (Low‑profile Fine‑pitch Ball Grid Array)
Mounting TypeSurface Mount Device (SMD/SMT)
Surface Marking / SilkscreenSAL-TC277TP-64F200N DC,Marking
Core ArchitectureTriple‑Core 32‑Bit TriCore™ v1.6.1; 2‑core lockstep for safety
Maximum CPU Speed200 MHz
Program Memory (Flash)4 MB On‑Chip Flash Memory (with ECC)
RAM Capacity472 KB SRAM (includes cache, with ECC)
Emulated EEPROM64 KB
Operating VoltageExternal supply: 3.3 V / 5.0 V; Core voltage 1.2 V generated by on‑chip LDO
Operating Temperature-40°C to +150°C (Junction Temperature, Extended Automotive Grade)
Total I/O PinsUp to 169 general‑purpose I/O pins
ADC Specifications14 ADC modules; 60‑channel 12‑bit SAR ADC + 6‑channel Sigma‑Delta ADC
Peripherals & InterfacesCAN FD, FlexRay, 100‑Mbit Ethernet, LIN, QSPI, HSM, FPU, 64‑channel DMA, GTM Timer Module, Watchdog, ASC, MSC, I2C, HSSL

Typical Applications

  • Automotive Transmission Control Units (TCU) and Powertrain Electronics
  • Under‑the‑Hood Engine Management and EV/HEV Inverter Controllers
  • Advanced Driver Assistance Systems (ADAS) and Radar Domain Controllers
  • Chassis Control Systems, Brake‑by‑Wire, and Steering Control ECUs
  • High‑Reliability Extreme‑Temperature Industrial and Aerospace Control Systems

Order & Shipping Info

Minimum Order Quantity (MOQ)1 Piece
Shipping TimeShipped within 1‑2 business days
Delivery Time3‑7 working days worldwide
Shipping MethodsDHL, UPS, FedEx, EMS
Payment MethodsT/T (Bank Transfer), PayPal, Credit Card, Western Union

Technical Support

For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.

Frequently Asked Questions

Q1: What does the “SAL” prefix stand for compared to “SAK”?

A: SAL is extended‑temp grade (‑40℃~+150℃ Tj). SAK is standard‑temp grade (‑40℃~+125℃ Tj). Same pinout & hardware, only thermal rating differs.

Q2: How many core processors does SAL‑TC277TP‑64F200N DC integrate?

A: Triple‑core 32‑bit TriCore™ up to 200 MHz. Two cores run lockstep for ASIL‑D safety; one independent application core.

Q3: Does SAL‑TC277TP‑64F200N DC support ISO 26262 ASIL‑D?

A: Yes. Built‑in lockstep cores, ECC memory, SMU and MPU for ISO 26262 ASIL‑D / SIL‑3 compliance.

Q4: How to get datasheets, pinout or quotes for SAL‑TC277TP‑64F200N DC?

A: Request datasheets, footprint, stock and volume pricing via our Quick Inquiry form.

Q5: What are pin‑compatible direct alternatives?

A: Direct pin‑to‑pin: SAK‑TC277TP‑64F200N DC. TC279 series need firmware modification. No cross‑brand drop‑in replacement.

Q6: What do the part‑number segments mean?

A: SAL=high‑temp grade; TC277=device family; TP=PG‑LFBGA‑292 package; 64=4 MB Flash; F200=200 MHz; N=temp bin; DC=automotive sorting.

Q7: Can SAL‑TC277TP‑64F200N DC replace SAK‑TC277TP‑64F200N DC on existing PCB?

A: Yes, same PG‑LFBGA‑292 footprint. Confirm thermal design, SAL supports higher 150℃ junction temperature.

Q8: What is the difference of package suffix “TP”?

A: TP = PG‑LFBGA‑292 low‑profile BGA. Other suffixes use different packages. Non‑TP parts are not pin‑compatible for direct PCB swap.

Q9: Does this MCU have on‑chip LDO regulator?

A: Yes. External 3.3 V/5.0 V input; on‑chip LDO generates 1.2 V core voltage internally.

Q10: Are SAL and SAK variants fully software‑compatible?

A: Yes. Same register map and instruction set. Only temperature grade differs; no firmware changes required.

Q11: Why is “SAL” not printed on chip silkscreen?

A: SAL only appears on reel/label. Chip marking only shows TC277TP‑64F200N.

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