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SCIMX007AVV1C
SCIMX007AVV1C
| Part Number | SCIMX007AVV1C |
|---|---|
| Manufacturer | NXP Semiconductors |
| Category | Integrated Circuits (ICs) > Embedded – Microprocessors |
| Description | Automotive & industrial i.MX007 multimedia application processor, ARM Cortex-A7 core up to 1GHz, integrated 2D/3D GPU, multi-channel video codec, dual CAN & Gigabit Ethernet interfaces, MAPBGA automotive-grade package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The SCIMX007AVV1C is NXP’s AEC-Q100 Grade 3 automotive i.MX7 Solo SoC built around a single 1GHz ARM Cortex-A7 core. Equipped with integrated 2D/3D GPU and H.264 hardware video codec, it delivers smooth UI rendering and multi-stream video processing. It supports DDR3L/LPDDR3 memory up to 1GB, and integrates abundant peripherals including dual CAN 2.0B, Gigabit Ethernet MAC, USB 2.0 OTG and dual display interfaces (LVDS/RGB/MIPI DSI). Packaged in 169-ball MAPBGA, it features wide -40℃~+105℃ temperature range, long-term supply and robust stability for automotive infotainment, industrial HMI and edge gateway devices.
Core Advantages
Advanced Multimedia and Graphics Compute
Integrates dedicated hardware graphics accelerators and a multi-format video engine, enabling seamless rich-media execution, complex 3D rendering, and fast vector UI graphics with lower power overhead.
Comprehensive Peripheral and Storage Integration
Natively features a robust array of communication lines—including dual Gigabit Ethernet, high-speed USB channels, and automotive-standard CAN networks—minimizing the need for external interface bridges.
Industrial and Automotive-Grade Reliability
Engineered for continuous operation under harsh ambient conditions, offering -40℃ ~ +105℃ extended thermal tolerance alongside hardware-enforced secure boot protocols to protect sensitive application firmware assets.
Optimized Power Management Architecture
Utilizes intelligent dynamic voltage and frequency scaling (DVFS) alongside independent power-domain gating to minimize active and standby power footprints, maximizing energy efficiency in fanless layouts.
Key Specifications
| Brand | NXP Semiconductors i.MX007 Automotive Application Processor Series |
|---|---|
| RoHS Status | RoHS Compliant / Lead-Free / Green Halogen-Free Materials Standard Approved |
| EDA/CAD Model | 3D STEP Models, Schematic Symbols, and PCB Layout Footprints available upon request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 169-MAPBGA |
| Mounting Type | Surface Mount Technology (SMD/SMT Reflow Assembly) |
| Surface Marking / Silkscreen | SCIMX007AVV1C Marking |
| Core Processor Architecture | Single 32-bit ARM® Cortex®-A7 Core |
| Maximum Clock Frequency Speed | 1GHz Nominal Operating Clock |
| Memory Controller Support | DDR3L / LPDDR3 Memory Interface, max 1GB External Memory Capacity |
| Graphics Acceleration Processing | Integrated 2D Vector GPU + 3D GPU Engine supporting OpenGL ES 2.0 |
| Video Codec Support | Hardware H.264 HD Decoder & Encoder, Multi-format MPEG4 / MJPEG Processing |
| Display Interface Channels | Dual Display Outputs: LVDS, Parallel RGB, MIPI DSI |
| Network Connectivity Controllers | Integrated Gigabit Ethernet MAC (10/100/1000 Mbps), High-Speed USB 2.0 OTG with Integrated PHY, Dual CAN 2.0B Nodes |
| Supply Operating Voltage | Core 1.0V, I/O 3.3V, Memory 1.35V Typical |
| Operating Temperature Range | -40°C to +105°C (Automotive AEC-Q100 Grade 3 Extended Thermal Specification) |
| Brand Series | NXP i.MX7 Solo Automotive Multimedia Processor Family |
| Automotive Qualification | AEC-Q100 Grade 3 Certified for automotive application scenarios |
| Hardware Security Features | Integrated Secure Boot, On-chip OTP memory for firmware encryption |
Typical Applications
- Automotive Infotainment Systems, Digital Instrument Clusters, and Telematics Control Units
- Industrial Human-Machine Interfaces (HMI), Rugged Factory Automation Panels, and CNC Terminal Screens
- Intelligent Edge-Computing Gateways, Smart Grid Infrastructure Concentrators, and IoT Network Hubs
- Medical Imaging Monitors, Portable Patient Diagnostic Workstations, and Patient Monitoring Equipment
- Digital Signage Media Players, High-Definition Video Conferencing Terminals, and Advanced Retail Vending Systems
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: Is your currently available stock of the SCIMX007AVV1C 100% genuine and original?
A: Yes, we guarantee that all SCIMX007AVV1C processors in our inventory are 100% brand-new, factory-original components sourced directly from NXP Semiconductors. Every production lot is tracked under strict traceability logs and dispatched inside sealed, original moisture-barrier packaging to ensure complete safety for the BGA sphere layout.
Q2: What are the main system architectural benefits of selecting an i.MX processor like the SCIMX007AVV1C for graphical HMI panels?
A: The SCIMX007AVV1C features dedicated on-chip 2D and 3D graphics hardware acceleration blocks. By managing GUI layers, window compositing, and font rendering directly in silicon, it offloads heavy pixel processing tasks from the primary ARM CPU core. This ensures highly responsive touch interfaces and steady frame rates even during heavy network communication or file I/O operations.
Q3: Does this specific NXP application processor support fanless industrial design models?
A: Yes, it is highly suited for fanless configurations. Built with advanced power domains and dynamic frequency scaling, the SCIMX007AVV1C dynamically reduces its clock frequency and turns off idle hardware modules based on real-time task demands. Combined with a thermally efficient MAPBGA packaging layout, it effectively keeps heat dissipation to a minimum, ensuring reliable operation without mechanical cooling fans.
Q4: How can our design engineers request full hardware development manuals, reference board layouts, or bulk quotes?
A: Please enter your technical project goals and desired volume metrics into our web-based Quick Inquiry form on this webpage. Our specialized embedded processing application desk will analyze your parameters and follow up with complete data assets and customized volume commercial pricing tables within 24 hours.
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