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THGBM5G6A2JBAIR
THGBM5G6A2JBAIR
| Part Number | THGBM5G6A2JBAIR |
|---|---|
| Manufacturer | Kioxia (Formerly Toshiba Memory) |
| Category | Integrated Circuits (ICs) > Memory – eMMC (Embedded MultiMediaCard) |
| Description | 8GB eMMC 4.51 Managed NAND Flash Memory, High-Speed JEDEC Interface, 3.3V/1.8V VCC, 153-FBGA Package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The THGBM5G6A2JBAIR is a high-density eMMC memory solution developed by Kioxia (formerly Toshiba Memory). This single-chip product features 8GB storage, integrating high-speed NAND Flash and an embedded controller compliant with JEDEC eMMC 4.51 standard. The built-in controller handles ECC, bad block management, wear leveling and garbage collection to reduce host load. Supporting dual power supplies, it delivers stable throughput and low latency. Packaged in 153-ball FBGA, it is a reliable embedded storage option for mobile equipment, smart IoT, automotive electronics and industrial embedded systems.
Core Advantages
Autonomous On-Chip Memory Controller
The integrated controller completes wear leveling, bad block management and ECC operations independently, lowering CPU burden and simplifying software development.
High-Speed Data Transfer Capabilities
Supports JEDEC eMMC high-speed interface with 8-bit data bus, enabling fast boot speed and efficient read-write performance for embedded operating systems.
Compact 153-FBGA Footprint
Adopts standard 153-ball FBGA packaging, saving PCB space while offering good mechanical stability for compact mobile hardware.
Enhanced Reliability & Endurance
Advanced flash optimization algorithms extend service life, guarantee long-term data retention and defend data integrity against power fluctuations.
Key Specifications
| Brand | Kioxia / Toshiba |
|---|---|
| RoHS Status | RoHS Compliant / Lead-Free / Halogen-Free |
| EDA/CAD Model | Schematic symbol models, 3D CAD step profiles, and 153-FBGA footprint land patterns are available on request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 153-FBGA (11.5 mm × 13.0 mm × 1.0 mm, 0.5mm Pitch) |
| Mounting Type | Surface Mount (SMT / SMD) |
| Surface Marking / Silkscreen | THGBM5G6A2JBAIR / Toshiba logo, Marking |
| Memory Density / Capacity | 8 Gigabytes (8GB / 64 Gbits) |
| Memory Type | NAND Flash (eMMC Managed Storage) |
| eMMC Interface Standard | JEDEC eMMC 4.51 |
| Bus Width | 1-bit, 4-bit, or 8-bit Parallel Data Bus |
| NAND Supply Voltage (VCC) | 2.7V to 3.6V (3.3V Nominal) |
| I/O Supply Voltage (VCCQ) | 1.7V to 1.95V (1.8V Nominal) or 2.7V to 3.6V (3.3V Nominal) |
| Operating Temperature Range | -25°C to +85°C (Extended Operating Grade) |
| NAND Type | MLC NAND Flash |
| Features | Power Off Notification, Sanitize Function, Internal ECC & Bad Block Management |
| Standard Compliance | JEDEC eMMC 4.51, Backward compatible with eMMC 4.41 |
Typical Applications
- Smartphones, mid-range tablets, e-readers, and handheld multimedia systems
- Industrial single-board computers (SBCs), edge AI gateways, and human-machine interface (HMI) displays
- Automotive infotainment, digital dashboards, advanced driver-assistance system (ADAS) logs, and telematics
- Smart home controllers, OTT set-top boxes, smart TVs, and IP surveillance systems
- Commercial Point-of-Sale (POS) terminals, medical monitoring devices, and smart energy meters
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: How does the THGBM5G6A2JBAIR differ from the THGBM5G5A1JBAIR?
A: THGBM5G6A2JBAIR is 8GB capacity, while THGBM5G5A1JBAIR is 4GB. It also includes optimized die and controller performance.
Q2: Can THGBM5G6A2JBAIR work as boot storage for Linux or Android embedded systems?
A: Yes. It supports JEDEC standard boot partition, suitable as main boot storage for Linux, Android and RTOS embedded platforms.
Q3: Is THGBM5G6A2JBAIR pin-to-pin compatible with other 153-ball eMMC ICs?
A: Yes. It follows standard 153-FBGA pinout (11.5×13.0mm, 0.5mm ball pitch), compatible with common 153-ball eMMC PCB footprints.
Q4: Does this eMMC support data protection during unexpected power failure?
A: Yes. Built-in power loss protection mechanism helps protect data integrity when sudden power cut occurs.
Q5: What eMMC specification standard does THGBM5G6A2JBAIR comply with?
A: It conforms to JEDEC eMMC 4.51 standard, backward compatible with eMMC 4.41 interface.
Q6: What NAND type is adopted for THGBM5G6A2JBAIR?
A: This chip adopts MLC NAND flash with integrated controller for memory management.
Q7: Is THGBM5G6A2JBAIR suitable for industrial embedded equipment?
A: Yes. Operating temperature range from -25°C to +85°C, widely used in industrial control, IoT gateway and automotive embedded devices.
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