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THGBMJG6C1LBAIL
THGBMJG6C1LBAIL
| Part Number | THGBMJG6C1LBAIL |
|---|---|
| Manufacturer | Kioxia (Formerly Toshiba Memory) |
| Category | Integrated Circuits (ICs) > Memory – eMMC (Embedded MultiMediaCard) |
| Description | 8GB eMMC 15nm High-Performance Managed NAND Flash Memory, JEDEC Interface, 3.3V/1.8V VCC, 153-FBGA Package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The THGBMJG6C1LBAIL is a high-density 8GB eMMC managed NAND flash memory from Kioxia (Formerly Toshiba Memory). Based on 15nm flash technology, this single-chip device integrates NAND flash and independent memory controller. Fully compliant with JEDEC eMMC specifications, it undertakes wear leveling, bad block management, address mapping and ECC correction to reduce host processor burden. Supporting dual voltage VCC and VCCQ, it provides stable throughput and power efficiency. Packaged in compact 153-ball FBGA, it serves as reliable drop-in storage for mobile equipment, smart IoT devices, automotive electronics and industrial embedded systems.
Core Advantages
Fully Autonomous Flash Controller Integration
The built-in controller automatically executes ECC, wear leveling and garbage collection, lowering CPU load and simplifying software development.
High-Speed JEDEC Interface Standard
Supports high-bandwidth eMMC bus to realize fast read/write speed, enabling rapid system boot and efficient file transmission.
Advanced 15nm NAND Flash Technology
Adopts mature 15nm process, featuring high storage density, good operating efficiency and stable long-term data retention.
Compact 153-FBGA Package & Robust Reliability
Standard 153-ball FBGA packaging provides excellent shock and vibration resistance, suitable for compact and rugged embedded hardware.
Key Specifications
| Brand | Kioxia / Toshiba |
|---|---|
| RoHS Status | RoHS Compliant / Lead-Free / Halogen-Free |
| EDA/CAD Model | Schematic symbol models, 3D CAD step profiles, and 153-FBGA footprint land patterns are available on request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 153-FBGA (11.5 mm × 13.0 mm × 0.8 mm, 0.5mm Ball Pitch) |
| Mounting Type | Surface Mount (SMT / SMD) |
| Surface Marking / Silkscreen | THGBMJG6C1LBAIL Marking |
| Memory Capacity | 8 Gigabytes (8GB / 64 Gbits) |
| Flash Technology Node | 15nm Process (NAND Flash) |
| NAND Type | TLC/MLC Hybrid Architecture |
| eMMC Interface Standard | JEDEC eMMC 5.1 |
| Bus Width | 1-bit, 4-bit, or 8-bit Parallel Data Bus |
| Maximum Clock Frequency | 52MHz (Equivalent up to 200MHz in HS400 Mode) |
| Sequential Read Speed | 215MB/s |
| Sequential Write Speed | 35MB/s (HS400 / 1.8V Condition) |
| NAND Supply Voltage (VCC) | 2.7V to 3.6V (3.3V Nominal) |
| I/O Supply Voltage (VCCQ) | 1.7V to 1.95V (1.8V Nominal) or 2.7V to 3.6V (3.3V Nominal) |
| Operating Temperature Range | -25°C to +85°C (Commercial Operating Grade) |
| Device Lifecycle Status | Obsolete / Discontinued |
Typical Applications
- Embedded Linux and Android system boot/data storage for single-board computers (SBCs)
- Smartphones, tablets, e-readers, and portable smart handheld devices
- Automotive infotainment, digital dashboards, telematics control units, and driving recorders
- Smart home hubs, set-top boxes (STB), smart TVs, and IP surveillance equipment
- Industrial control panels, POS payment terminals, and mobile medical instruments
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: What is the main distinction between THGBMJG6C1LBAIL and THGBMFG6C1LBAIL?
A: Both are 8GB 15nm Kioxia eMMC with 153-FBGA package. THGBMJG6C1LBAIL adopts eMMC 5.1 interface, while THGBMFG6C1LBAIL uses eMMC 4.41. They differ in controller firmware and host chipset adaptation.
Q2: Can THGBMJG6C1LBAIL be used as a drop-in replacement on existing eMMC PCB footprints?
A: Yes. It follows standard 153-ball FBGA dimension (11.5 mm × 13.0 mm, 0.5mm ball pitch), physically pin-to-pin compatible with common 153-ball eMMC layouts.
Q3: How does the internal controller handle unexpected power loss?
A: Built-in power failure protection will flush cached data to flash when voltage drops, effectively preventing file and data corruption.
Q4: Does THGBMJG6C1LBAIL support booting operations for ARM and x86 architectures?
A: Yes. Equipped with JEDEC standard boot partitions, it allows ARM and x86 processors to boot directly from this eMMC.
Q5: What is the lifecycle status of THGBMJG6C1LBAIL?
A: This component is obsolete / discontinued. We can recommend compatible alternative eMMC models upon request.
Q6: What operating temperature range does this eMMC support?
A: Operating temperature: -25°C ~ +85°C, commercial grade, suitable for consumer and general embedded equipment.
Q7: Are datasheets, schematic and 3D footprint files available?
A: Yes. Please send us an inquiry, we can provide related technical documents for hardware design reference.
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