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USB3382-AB50NI G

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USB3382-AB50NI G

Part NumberUSB3382-AB50NI G
ManufacturerBroadcom (Avago acquired PLX Technology)
CategoryIntegrated Circuits (ICs) > Interface – Controllers / PCIe-to-USB Bridges
DescriptionHigh-performance PCI Express Gen 2 to USB 3.0 SuperSpeed Peripheral Controller, featuring dual PCIe x1 ports, single USB 3.0 downstream transceiver, integrated PHYs, and low-power hardware acceleration.
Stock StatusIn Stock
OriginOriginal Factory

Product Overview

The USB3382-AB50NI G PCIe Gen2 to USB3.0 bridge was originally developed by PLX Technology and now belongs to Broadcom after Avago’s acquisition. This single-chip device carries full-rate high-bandwidth data transfer via dual independent PCIe Gen2 x1 upstream ports and one USB3.0 downstream port with internal crossbar forwarding. Built-in multi-domain power management cuts idle power consumption for embedded and industrial devices. Housed in a compact 10 mm × 10 mm QFN-136 package with link training and loopback circuits, it fits SBC expansion cards, video capture gear, medical data acquisition equipment and compact storage adapters.

Core Advantages

Dual Independent PCIe Gen2 Upstream Ports

Two separate PCIe x1 Gen2 interfaces connect to host boards via internal high-speed crossbar switch, supporting parallel data transmission without bandwidth bottlenecks for multi-host expansion equipment.

Integrated Low-Latency PCIe & USB PHYs

On-die physical layer transceivers eliminate external discrete PHY chips, reducing BOM count, simplifying high-frequency PCB routing and lowering multi-layer board manufacturing cost.

Low Operational & Active Standby Power Profiles

Hardware power gating disables unused circuit blocks dynamically, meeting energy efficiency standards and minimizing thermal load for fanless sealed small-form-factor devices.

4 Independent Scatter-Gather DMA Engines

Built-in programmable DMA channels offload bulk packet processing from host CPU, drastically reducing system latency and freeing main processor resources for core application tasks.

Key Specifications

BrandBroadcom / Former PLX Technology ExpressTunnel Series
PCIe Compliance StandardFully compliant with PCI Express Base Specification 2.1
USB Compliance StandardUSB 3.0 Specification Rev 1.0, backward compatible with USB 2.0 & USB 1.1
RoHS StatusRoHS Compliant / Lead-Free / Halogen-Free Materials Standard
Moisture Sensitivity LevelMSL 3 (168 Hours Floor Life, Baking Required Prior To SMT Assembly)
EDA/CAD Model3D STEP Models, Schematic Symbols, and PCB Footprint assets available upon request
Warranty1-Year Standard Quality Warranty
Package / CaseQFN-136 (136 Pins,10 mm × 10 mm × 0.5 mm)
Mounting TypeSurface Mount Technology (SMD/SMT)
Surface Marking / SilkscreenUSB3382-AB50NI G Marking
PCI Express InterfaceDual PCIe Gen 2 ports, 5.0 Gbps per lane interconnect speed, x1 link architecture for each channel
USB Interface OutputSingle USB 3.0 SuperSpeed Downstream Port, 5 Gbps line speed, backward compatible with USB 2.0
USB Device Endpoint ClassesSupports Bulk, Isochronous, Interrupt, and Control endpoint routing parameters
Internal Architecture ClassExpressTunnel™ Dynamic Hardware Bridging Control Framework
Supply Rail RequirementsCore Logic 1.0 V / I/O Buffers 1.8 V and 3.3 V Multi-Voltage Subsystem Domains
DMA Architecture4 Descriptor-based Independent Programmable High-Speed DMA Engines
Maximum Power ConsumptionTypical 1.2W full operating load power draw
Operating Temperature Range-40°C to +85°C (Industrial-Grade Operational Temperature Envelope)
Storage Temperature Range-55°C ~ +125°C Long-Term Storage Temperature Limit

Typical Applications

  • Embedded System Single Board Computers (SBCs), Industrial PC Expansion Cards, and Compact PC/104 Modules
  • High-Definition Video Capture Cards, Multi-Channel Frame Grabbers, and Real-Time Streaming Hardware
  • Medical Imaging Display Handlers, Diagnostic Data Acquisition Backplanes, and High-Precision Lab Instruments
  • Storage Subsystem Adapters, External PCIe-to-USB Storage Enclosures, and RAID Telemetry Modules
  • Wireless Telecommunication Base Stations, Advanced Network Gateways, and Routers with USB Expansion Slots

Order & Shipping Info

Minimum Order Quantity (MOQ)1 Piece
Shipping TimeShipped within 1-2 business days
Delivery Time3-7 working days worldwide
Shipping MethodsDHL, UPS, FedEx, EMS
Payment MethodsT/T (Bank Transfer), PayPal, Credit Card, Western Union

Technical Support

For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.

Frequently Asked Questions

Q1: Is your currently available stock of the USB3382-AB50NI G controller 100% genuine and original?

A: Yes, we guarantee that all USB3382-AB50NI G components in our warehouse are 100% brand-new, factory-original products sourced from Broadcom legacy stock. Every batch is packed in vacuum-sealed Moisture Barrier Bags (MBB) with full ESD protection to preserve solderability and chip integrity.

Q2: What is the primary benefit of the unique “QFN” package configuration used on the USB3382?

A: The QFN (Advanced Quad Flat No-Lead) package combines low profile, low parasitic inductance and excellent thermal dissipation. Its staggered multi-row pin layout supports high pin count while simplifying high-speed PCB escape routing, cutting multi-layer PCB cost compared to micro-BGA alternatives.

Q3: Does this bridging chip require specialized driver installation to operate under modern operating systems?

A: The USB3382-AB50NI G complies with standard PCIe and USB protocol specifications. Standard use cases like mass storage and generic communication work with native built-in drivers for Windows, Linux and mainstream RTOS. Custom proprietary hardware functions can be developed with official Broadcom SDK packages.

Q4: How can our physical engineering group get formal component engineering drawings, firmware binary packages, or request bulk wholesale pricing tiers?

A: Please complete the Quick Inquiry form on this webpage with your target purchase quantities. Our application support team will deliver complete technical documentation and tiered bulk pricing within 24 hours.

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