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XC3S1000-4FGG456I
XC3S1000-4FGG456I
| Part Number | XC3S1000-4FGG456I |
|---|---|
| Manufacturer | Xilinx (AMD) |
| Category | Integrated Circuits (ICs) > Embedded – FPGAs (Field Programmable Gate Array) |
| Description | Spartan-3 Field Programmable Gate Array, 1M Gates, 17280 Logic Cells, 432Kbit Block RAM, Industrial Grade, Pb-Free FBGA-456 (23x23mm) package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The XC3S1000-4FGG456I is a highly successful, high-density Field Programmable Gate Array (FPGA) within the cost-optimized Spartan-3® family developed by Xilinx (now AMD). Specifically engineered to deliver a revolutionary balance of high logic capacity and consumer-friendly pricing, this device offers a platform density of 1 million system gates. It is manufactured using an advanced 90nm process technology with an efficient 1.2V core voltage architecture. Featuring 17,280 logic cells, dedicated 18×18-bit multipliers, and robust Digital Clock Managers (DCMs), the easily accommodates highly parallel processing pipelines, custom timing algorithms, and high-speed data handling. Housed in a lead-free (Pb-Free) FBGA-456 (23x23mm) package and fully specified for extended industrial operating temperatures, this FPGA remains a premier component for industrial automation, distributed medical processing systems, telecom line cards, and automotive instrumentation grids.
Core Advantages
Cost-Effective 1-Million Gate Density
Delivers an expansive 1,000,000 system gate matrix and 17,280 logic cells, allowing developers to consolidate complex glue-logic, soft-core processors, and multiple peripheral interfaces onto a single piece of silicon at an economical price point.
Dedicated Math Co-Processing Accelerators
Integrates 24 discrete, dedicated hardware 18-bit x 18-bit multipliers that run concurrently outside the standard logic array blocks, enabling rapid, multi-channel Digital Signal Processing (DSP) executions like FIR filters and digital mixing.
Advanced Clock & Interconnect Control
Equipped with 4 sophisticated internal Digital Clock Managers (DCMs) providing ultra-precise clock multiplying, dividing, phase shifting, and duty cycle conditioning to guarantee stable, jitter-free timing distribution across complex systems.
Industrial-Grade Reliability Compliance
Fully rated to perform flawlessly across extreme industrial environment conditions ranging from -40°C to +100°C junction temperature, securing predictable operational lifecycles and reliable hardware performance.
Key Specifications
| Brand | Xilinx (AMD) |
|---|---|
| RoHS Status | RoHS Compliant / Lead-Free (Pb-Free) Green Package Standard |
| EDA/CAD Model | 3D Model & PCB Footprint Available upon request |
| Warranty | 1-Year Standard Factory Warranty |
| Package / Case | FBGA-456 (23x23mm) |
| Mounting Type | Surface Mount Technology (SMD/SMT) |
| Surface Marking / Silkscreen | XC3S1000™ Marking |
| FPGA Family Name | Spartan-3® Platform Architecture |
| Total Estimated System Gates | 1,000,000 System Gates |
| Logic Cells Count | 17,280 Logic Cells |
| Total Embedded Block RAM (BRAM) | 432 Kbit (24 Blocks of 18 Kbit each) |
| Dedicated 18×18 Multipliers | 24 Embedded Hardware Blocks |
| Maximum Digital User I/O Pins | 333 Available Multi-Standard I/O Lines |
| Internal Core Voltage Requirement | 1.14V to 1.26V DC (1.2V Nominal Core) |
| Operating Temperature Range | -40°C to +100°C (Extended Industrial Junction Temperature Window) |
Typical Applications
- Industrial Automated Control Systems, Motor Drives, and Robotics Backplanes
- Telecommunication Infrastructure Interface Cards and Custom High-Speed Protocol Gateways
- Medical Imaging Nodes, Clinical Diagnostics Equipment, and Real-Time Patient Monitoring
- Automotive In-Vehicle Infotainment Display Pipelines and Fleet Telemetry Nodes
- Test & Measurement Instrumentation, Custom High-Speed Data Acquisition Systems, and FPGA Prototyping
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: Is your current warehouse stock of the XC3S1000-4FGG456I completely genuine and new?
A: Yes, we guarantee that all XC3S1000-4FGG456I FPGAs in our inventory are 100% brand-new, authentic factory-original products from Xilinx (AMD), strictly handled under standard anti-static ESD shielding and moisture-controlled conditions.
Q2: What do the individual codes inside the suffix sequence “-4FGG456I” indicate?
A: The “-4” signifies the standard core speed grade performance rating. The “GG” specifies the lead-free (Pb-Free) Matte-Sn finish package layout, “456” denotes the 456-pin Ball Grid Array blueprint, and the trailing letter “I” certifies qualification for Industrial operating temperatures (-40°C to +100°C).
Q3: What is the primary difference between the FG456 and FGG456 ordering codes?
A: The standard “FG456” package contains leaded solder balls (Sn/Pb), while the “FGG456” package uses completely lead-free (Pb-free) material compositions, making it fully compliant with global RoHS and green environment manufacturing standards.
Q4: How can our engineering desk obtain configuration bitstream tools or older ISE design suite guidelines for this part?
A: Please complete our Quick Inquiry web form on this page with details about your processing parameters. Our application support desk will process your inquiry and dispatch the available technical documentation package within 24 hours.
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