Share to:
XC3S2000-4FGG456I
XC3S2000-4FGG456I
| Part Number | XC3S2000-4FGG456I |
|---|---|
| Manufacturer | AMD / Xilinx |
| Category | Integrated Circuits (ICs) > Embedded – FPGAs (Field Programmable Gate Array) |
| Description | Spartan-3 High-Density FPGA, 2.0M System Gates, 46,080 Logic Cells, 432Kbits RAM, 333 User I/Os, Industrial Grade, 456-FBGA Package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The XC3S2000-4FGG456I is a high-density, cost-effective FPGA in AMD (formerly Xilinx) Spartan-3 family. Manufactured on 90nm CMOS technology, it features 2 million system gates, 46,080 logic cells, 432 Kbits Block RAM and 40 dedicated 18×18 multipliers to support embedded DSP and custom digital logic. It offers up to 333 programmable user I/Os grouped by voltage banks, supporting RSDS, LVCMOS, HSTL, PCI and other signal standards. Housed in a 456-ball FBGA package and rated for -40°C to +100°C industrial temperature range, it fits industrial automation, telecom gateways, medical electronics and video processing systems.
Core Advantages
Cost-Optimized High System Logic Capacity
Provides 2 million equivalent system gates and 46,000+ logic cells on the 90nm platform, delivering high logic density for complex embedded designs with controlled hardware costs.
Dedicated Hardware Multipliers & Digital Clock Managers (DCMs)
Equipped with 40 dedicated 18×18 multipliers for high-speed DSP operations and 4 DCMs for accurate clock synthesis, jitter suppression and phase shifting.
Flexible Multi-Standard Single-Ended and Differential Output I/O
Up to 333 user I/O pins support multiple single-ended and differential standards including RSDS, HSTL, SSTL and 33/66MHz PCI for broad system interface compatibility.
Industrial Temperature Reliability & Lead-Free Assembly
Fully qualified for harsh industrial environments (-40°C to +100°C). RoHS-compliant lead-free FBGA package for outdoor and factory industrial applications.
Key Specifications
| Brand | AMD / Xilinx Spartan-3 Series |
|---|---|
| RoHS Status | RoHS Compliant / Lead-Free / Green Package (FGG Suffix) |
| EDA/CAD Model | Schematic symbol models, 3D CAD step profiles, and 456-FBGA footprint land patterns are available on request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 456-FBGA (23.00 mm × 23.00 mm, 1.00 mm Pitch) |
| Mounting Type | Surface Mount (SMT / SMD) |
| Surface Marking / Silkscreen | XC3S2000 FGG456 Marking |
| System Gates Rating | 2,000,000 System Gates |
| Logic Cells / Logic Elements | 46,080 Logic Cells (5,120 Configurable Logic Blocks – CLBs) |
| Total Block RAM Bits | 432 Kbits (24 Block RAM Blocks of 18Kbits each) |
| Distributed RAM Bits | 320 Kbits |
| Hardware Multipliers (18×18) | 40 Dedicated Multipliers |
| Digital Clock Managers (DCM) | 4 Hardware DCM Blocks |
| Number of User I/Os | Up to 333 User I/O Pins |
| Core Operating Voltage (VCCINT) | 1.2V ± 5% Core Logic Rail |
| Auxiliary Voltage (VCCAUX) | 2.5V |
| Operating Temperature Range | -40°C to +100°C (Industrial Grade Specification) |
| Speed Grade | -4 (Typical CLB combinatorial delay 0.61ns) |
| Maximum Internal Operating Frequency | 630 MHz |
| Technology Process | 90nm CMOS |
| Configuration Mode | JTAG, Master Serial, Slave Serial, In-System Programmable |
| Lifecycle Status | End of Life (EOL) |
Typical Applications
- Industrial automation, motor drive control modules, and programmable logic controllers (PLCs)
- Video signal processing, display bridging, digital image enhancement, and LED control matrix systems
- Telecommunication gateways, networking line cards, and high-speed data router interfaces
- Medical imaging equipment, ultrasound digital processing modules, and patient monitoring hubs
- Test and measurement instrumentation, protocol analyzers, and high-speed data acquisition boards
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: What do the suffix elements in “XC3S2000-4FGG456I” specify?
A: XC3S2000 stands for Spartan-3 2.0M gate device; -4 is speed grade; FGG means RoHS lead-free FBGA package; 456 indicates pin quantity; I represents industrial temperature range (-40°C to +100°C).
Q2: Which development tools support the XC3S2000?
A: The XC3S2000-4FGG456I is compatible with Xilinx ISE Design Suite (Classic/WebPACK edition) for synthesis, placement, routing, timing analysis and bitstream generation.
Q3: How to load configuration bitstream into XC3S2000?
A: This FPGA uses volatile SRAM configuration. It loads bitstream on power-up from external non-volatile PROM or external processor via Master Serial, Slave Serial, Master Parallel and JTAG interfaces.
Q4: What power rails are required for XC3S2000-4FGG456I?
A: Three voltage rails are needed: 1.2V for VCCINT core supply, 2.5V for VCCAUX auxiliary circuits, and bank-selectable VCCO (1.2V~3.3V) matched to your I/O standards.
Q5: What is the lifecycle status of XC3S2000 series?
A: XC3S2000 is End of Life (EOL). We provide genuine stock for maintenance and legacy equipment projects.
Q6: Why is the pin count 456 but usable I/O limited to 333?
A: The 456 pins include power, ground and dedicated configuration pins. The maximum available programmable user I/O is 333.
Q7: Are there recommended alternative FPGAs for new designs?
A: For new projects, consider Spartan-6 or Artix-7 series for newer process, better performance and long-term supply stability.
Related Products
