Share to:
XC7K355T-2FFG901I
XC7K355T-2FFG901I
| Part Number | XC7K355T-2FFG901I |
|---|---|
| Manufacturer | AMD / Xilinx |
| Category | Integrated Circuits (ICs) > Embedded – FPGAs (Field Programmable Gate Array) |
| Description | Kintex-7 High-Performance FPGA, 356,160 Logic Cells, 25,740 Kbits RAM, 1,440 DSP Slices, 24 GTX Transceivers (12.5Gbps), Industrial Grade, 901-FCBGA Package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The XC7K355T-2FFG901I is a high-density, high-performance Kintex‑7 FPGA from AMD (formerly Xilinx), built on advanced 28 nm HKMG process. It provides an excellent balance of signal processing capability, power efficiency and cost performance. Equipped with 356,160 logic cells, 25,740 Kbits Block RAM and 1,440 DSP48E1 slices, this device integrates 24 high-speed GTX transceivers supporting data rates up to 12.5 Gbps, alongside PCIe Gen2 interfaces and up to 300 user I/Os. Housed in a 901-FCBGA package and qualified for industrial temperature range (-40°C to +100°C), it suits communications, wireless infrastructure, medical imaging and aerospace systems.
Core Advantages
28 nm HKMG Process for Optimized Power-Performance Ratio
Adopts mature 28 nm High-k Metal Gate technology, delivering outstanding performance while cutting power consumption versus older 45 nm FPGAs, supporting high-density design without thermal bottlenecks.
Ultra-High-Speed Serial GTX Transceivers
Integrated 12.5 Gbps GTX multi-gigabit transceivers, compatible with 10G/40G Ethernet, CPRI/OBSAI, PCI Express Gen1/Gen2, Serial RapidIO and other high-bandwidth protocols.
Massive DSP Computing Resources
Contains 1,440 high-performance DSP48E1 slices with pre-adders and 18×25 multipliers, supporting over 1 Tera-MAC/s parallel signal processing for radar, SDR and advanced video encoding.
Industrial-Grade Reliability & High-Density BGA Package
Supports continuous long-term operation within -40°C ~ +100°C industrial temperature range. Packaged in Pb-Free, RoHS-compliant 901-ball FBGA, ensuring stable mechanical and electrical performance under harsh working environments.
Key Specifications
| Brand | AMD / Xilinx Kintex-7 Series |
|---|---|
| Part Number | XC7K355T-2FFG901I |
| Speed Grade | -2 |
| RoHS Status | RoHS Compliant / Lead-Free / Green Package (FFG Suffix) |
| EDA/CAD Model | Schematic symbol models, 3D CAD step profiles, and 901-FBGA footprint land patterns are available on request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 901-FCBGA (31.00 mm × 31.00 mm, 1.00 mm Pitch) |
| Mounting Type | Surface Mount Technology (SMT / SMD) |
| Surface Marking / Silkscreen | XC7K355T FFG901 Marking |
| Logic Cells | 356,160 Logic Cells (55,650 Configurable Logic Blocks – CLBs) |
| Total Block RAM Bits | 25,740 Kbits (715 Blocks of 36 Kbits each) |
| DSP Slices (18 × 25) | 1,440 Dedicated DSP48E1 Slices |
| GTX Transceiver Count | 24 High-Speed Serial GTX Transceivers (Up to 12.5 Gbps) |
| PCI Express Block | Integrated PCIe Gen2 Hardware Block (×1, ×2, ×4, ×8 Lanes) |
| Number of User I/Os | Up to 300 SelectIO Pins |
| Core Voltage (VCCINT) | 1.0V ± 30mV Core Logic Rail |
| Auxiliary Voltage (VCCAUX) | 1.8V |
| Transceiver Supply (MGTAVCC) | 1.2V |
| Transceiver Termination (MGTAVTT) | 1.0V |
| I/O Bank Voltage Range | 1.2V ~ 3.3V configurable |
| Configuration Mode | JTAG, Master SPI, Slave Serial, PCIe |
| Operating Temperature Range | -40°C to +100°C (Industrial Grade Specification) |
Typical Applications
- 4G/5G wireless baseband processing units, remote radio heads (RRH), and CPRI/OBSAI optical link gateways
- Avionics radar signal processing, software-defined radios (SDR), and electronic warfare instrumentation
- High-end medical imaging platforms, 3D ultrasound beamforming, and digital MRI acquisition systems
- Ultra-HD 4K/8K broadcast video processing, real-time image compression, and video frame converters
- High-frequency financial trading systems, packet inspection engines, and high-speed data center accelerators
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Technical Support
For datasheets, samples, stock inquiry and bulk quotation, please submit the quick inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: What do the suffix codes in XC7K355T-2FFG901I stand for?
A1: XC7K355T = Kintex‑7 logic density; -2 = speed grade; FFG = flip-chip BGA package; 901 = ball count; I = industrial temperature range (-40°C ~ +100°C).
Q2: Which software is used to develop projects for XC7K355T?
A2: AMD Xilinx Vivado Design Suite (HL / Enterprise Edition) for synthesis, layout, power analysis and debugging.
Q3: How does XC7K355T load configuration data after power on?
A3: The FPGA loads bitstream from external SPI Flash via Master/Slave Serial, JTAG or PCIe interface.
Q4: What power rails are required for XC7K355T-2FFG901I?
A4: 1.0V(VCCINT),1.8V(VCCAUX),1.2V(MGTAVCC),1.0V(MGTAVTT); I/O banks support 1.2V~3.3V configurable voltage.
Q5: What typical applications suit XC7K355T?
A5: Wireless communication, medical imaging, radar processing, SDR, aerospace and high‑speed data acquisition systems.
Q6: Can you provide samples of XC7K355T-2FFG901I?
A6: Yes, we support sample testing. Contact us to check available stock and sample cost.
Q7: Which high-speed protocols do the GTX transceivers support?
A7: The 24-channel 12.5Gbps GTX supports 10G/40G Ethernet, PCIe Gen1/Gen2, CPRI, Serial RapidIO and other standard protocols.
Related Products
