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XC7V585T-2FFG1761I
XC7V585T-2FFG1761I
| Part Number | XC7V585T-2FFG1761I |
|---|---|
| Manufacturer | AMD Xilinx |
| Category | Integrated Circuits (ICs) > Embedded – FPGAs (Field Programmable Gate Array) |
| Description | Virtex®-7 T Family High-Performance FPGA, featuring 582,720 logic cells, 750 User I/Os, and 32x 12.5 Gbps GTX transceivers, designed on advanced 28nm HPL technology for high-bandwidth compute, networking, and defense systems. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The XC7V585T-2FFG1761I is an industrial high-performance Virtex-7 FPGA from AMD Xilinx, fabricated on 28nm HPL process. Equipped with 582,720 logic cells, 28.62Mb block RAM, 2,160 DSP48E1 slices and 32 GTX transceivers up to 12.5Gbps, it delivers powerful parallel signal processing. The -2I industrial grade ensures stable operation across -40℃~+100℃. Packaged in 1761-pin FFG flip-chip BGA, it serves high-bandwidth communication, radar, test measurement and high-density acceleration systems.
Core Advantages
Massive Logic and DSP Density
Integrates over 580K logic cells and 2,160 independent hardware DSP slices, providing massive parallel compute capability for processing real-time algorithmic workloads, hardware acceleration, and signal processing protocols.
Ultra-High Serial I/O Performance
Equipped with 32 high-efficiency GTX transceivers supporting data rates up to 12.5 Gbps, enabling seamless integration with multi-gigabit high-speed interconnect protocols such as PCIe Gen3, 10G/40G Ethernet, and Interlaken.
Optimized Power-to-Performance Ratio
Leverages Xilinx’s advanced 28nm HPL process technology alongside aggressive voltage scaling frameworks to drastically curtail static and dynamic power leakage, achieving supreme performance without thermal penalties.
Rugged Industrial Thermal Grade
Rated explicitly for an operating temperature matrix of -40°C to +100°C, offering hardware engineering groups standard-compliant reliability and long life cycles under harsh outdoor or tightly packed chassis bounds.
Key Specifications
| Brand | AMD Xilinx |
|---|---|
| RoHS Status | RoHS Compliant / Lead-Free Standard (Green Solder Ball Layout) |
| EDA/CAD Model | 3D Model & PCB Footprint Available upon request |
| Warranty | 1-Year Standard Factory Warranty |
| Package / Case | FFG-1761 (42.5mm x 42.5mm) |
| Mounting Type | Surface Mount Technology (SMD/SMT) |
| Surface Marking / Silkscreen | XC7V585T / FFG1761 Marking |
| Number of Logic Cells | 582,720 |
| Number of LABs/CLBs | 45,525 |
| Total Block RAM Bits | 28,620 KB (28.62 Mb) |
| Number of DSP Slices | 2,160 DSP48E1 Blocks |
| Number of User I/Os | 750 Inputs/Outputs |
| Serial Transceivers | 32x GTX Transceivers (Up to 12.5 Gbps per line) |
| Speed Grade Descriptor | -2 Speed Tier (High-Performance Core Tuning) |
| Operating Core Voltage Supply | 0.97V to 1.03V (Nominal 1.0V System Core Power Supply) |
| Operating Temperature Range | -40°C to +100°C (Industrial Junction Temperature $T_J$ Performance Bounds) |
| Clock Management Tiles (CMT) | 12 Independent Clock Management Tiles |
| PLL & MMCM Count | 12 Mixed-Mode Clock Managers (MMCM) + 12 Phase-Locked Loops (PLL) |
| Moisture Sensitivity Level (MSL) | MSL 3 (168 Hours Floor Life at 30°C / 60% RH) |
| GTX Minimum Data Rate | 500 Mbps per differential channel |
| Supported High-Speed Protocols | PCIe Gen3, 10G/40G Ethernet, Interlaken, SATA, Aurora, DisplayPort |
Typical Applications
- High-Capacity Wireline Core Networks, 100G/400G Line Cards, and Telecom Base Station Transceivers
- Advanced Aerospace Defense Systems, Digital Phased Array Radars, Secure Crypto Engines, and Guidance Controls
- High-Speed Test and Measurement Systems, Digital Logic Emulation Hubs, and High-Bandwidth Oscilloscopes
- Medical Digital Imaging Hardware, Real-Time High-Resolution Ultrasound Processing, and CT Scan Arrays
- High-Performance Computing (HPC) Accelerators, Financial High-Frequency Trading (HFT) Engines, and Data Center Compute Fabrics
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: Is your currently available inventory of the XC7V585T-2FFG1761I FPGA 100% genuine and factory-original?
A: Yes, we guarantee that all XC7V585T-2FFG1761I components in our warehouse are 100% brand-new, original factory stock from AMD Xilinx. They are managed, inspected, and shipped strictly within anti-static ESD shielding pipelines under standard MSL (Moisture Sensitivity Level) controls.
Q2: What do the code designations “-2” and “I” represent in the part number configuration?
A: The “-2” designator denotes the middle-high speed grade category of the Virtex-7 family matrix, offering significantly reduced propagation delays over standard -1 devices. The “I” character represents the industrial operating temperature grade, certified for safe, drift-free execution from -40°C up to +100°C.
Q3: Does the “FFG1761” package format mean this device is compatible with lead-free manufacturing processes?
A: Yes, the “G” in the package identifier FFG1761 specifies that the device uses an eco-friendly, lead-free (RoHS-compliant) flip-chip fine-pitch ball grid array structure with SAC-based lead-free solder ball compositions.
Q4: How can our hardware engineering division request IBIS simulation models, BSDL files, or ask for special project volume pricing tiers?
A: Please complete our Quick Inquiry web form on this page with details about your processing parameters. Our application support desk will process your inquiry and dispatch the available technical documentation package within 24 hours.
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