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XC7Z100-2FFG900I
XC7Z100-2FFG900I
| Part Number | XC7Z100-2FFG900I |
|---|---|
| Manufacturer | Xilinx (AMD) |
| Category | Integrated Circuits (ICs) > Embedded – System On Chip (SoC) / FPGAs |
| Description | Zynq-7000 All Programmable SoC, Dual ARM Cortex-A9 MPCore up to 800MHz, Kintex-7 Equivalent Programmable Logic Fabric, 444K Logic Cells, 16 GTP Transceivers, Industrial Grade, FCBGA-900 (31×31 mm) Package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The XC7Z100-2FFG900I is the flagship high-density device in the Xilinx (now AMD) Zynq®-7000 All Programmable SoC family. It integrates a dual-core ARM® Cortex®-A9 MPCore Processing System (PS) with high-performance Kintex®-7 equivalent Programmable Logic (PL), creating a unified platform that combines hardware flexibility with software execution power.
Built on advanced 28nm high-performance, low-power (HPL) process technology, this device features 444,000 logic cells, 2,020 DSP slices, and 16 high-speed GTP transceivers (up to 6.25 Gbps). Developers can offload compute-intensive tasks—such as real-time DSP, multi-channel video analytics, and software-defined radio—directly to the parallel PL fabric, while running embedded Linux or RTOS on the ARM core.
Packaged in a rugged 900-pin flip-chip FCBGA and qualified for industrial-grade temperatures (-40°C to +100°C), the XC7Z100-2FFG900I is ideal for high-end medical imaging, military communications, automated driving systems, and smart grid control equipment.
Core Advantages
True Software-Hardware Co-Design
Integrates a dedicated physical dual-core ARM Cortex-A9 processor with high-performance Kintex-7 FPGA fabric via thousands of internal AXI interconnect traces, establishing extreme data bandwidth and sub-microsecond latency between software stacks and customized hardware accelerators.
Exceptional Processing and DSP Density
Features 444K logic cells and 2,020 dedicated DSP48E1 slices, delivering multi-teraflop parallel computing performance to solve complex mathematical tasks, multi-axis motion calculations, or advanced digital filtering without straining memory resources.
High-Speed Serial Connectivity Bandwidth
Equipped with 16 integrated 6.25 Gbps GTP transceivers and an onboard PCI Express Gen2 x8 hard block, ensuring flawless implementation of high-throughput protocols like Gigabit Ethernet, SATA, and custom digital optical networks.
Industrial-Grade Reliability and Longevity
Designed and qualified to perform reliably across extended industrial junction temperatures (-40°C to +100°C), guaranteeing rugged mechanical and electrical stability in heavy industrial instrumentation, outdoor cellular base stations, and aerospace backplanes.
Key Specifications
| Brand | Xilinx (AMD) |
|---|---|
| RoHS Status | RoHS Compliant / Lead-Free Standard (Green Packaging) |
| EDA/CAD Model | 3D Model & PCB Footprint Available upon request |
| Warranty | 1-Year Standard Factory Warranty |
| Package / Case | FCBGA-900 (31×31 mm) |
| Mounting Type | Surface Mount Technology (SMD/SMT) |
| Surface Marking / Silkscreen | XC7Z100™ / FFG900 Marking |
| Architecture Family | Zynq®-7000 All Programmable SoC (Z-7100 Series) |
| Processing System (PS) Core | Dual-core ARM® Cortex®-A9 MPCore with NEON Extension and Single/Double Precision FPU |
| PS Clock Speed Grade | Up to 800 MHz (-2 Speed Performance Grade) |
| Programmable Logic (PL) Cells | 444,000 Logic Cells (Kintex®-7 Equivalent Fabric) |
| Total Internal Block RAM (BRAM) | 26.5 Mbits (755 blocks of 36 Kbits each) |
| DSP Slices Count | 2,020 Hardware DSP48E1 Slices |
| High-Speed Serial Transceivers | 16x GTP Transceivers (Operating up to 6.25 Gbps per lane) |
| Available Total User I/O Pins | 362 Input/Output lines (SelectIO™ blocks supporting up to 3.3V and differential standards) |
| Operating Junction Temperature | -40°C to +100°C (Industrial Temperature Grade Rating) |
Typical Applications
- Advanced Digital Signal Processing (DSP) & Multi-Channel Software-Defined Radio (SDR)
- Military Communications, Electronic Warfare Systems, Radar Digital Processing, and Avionics
- High-End Medical Diagnostic Imaging (3D Ultrasound, MRI, Computed Tomography Processing)
- Industrial Machine Vision, Real-Time Edge Video Analytics, and Smart Surveillance Clusters
- High-Speed Telecommunications Network Gateways, Backhaul Bridges, and Data Center Accelerators
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: Is your stock inventory of the XC7Z100-2FFG900I completely original and factory-new?
A: Yes, we guarantee that all XC7Z100-2FFG900I SoC chips in our inventory are 100% brand-new, authentic factory-original products from Xilinx (AMD), handled and shipped under strict anti-static ESD protection and dry moisture-barrier packaging.
Q2: What is decoded by the characters in the product suffix “-2FFG900I”?
A: The “-2” indicates the mid-high performance speed grade tier for both the ARM processing core and the FPGA fabric. “FFG900” details the physical 900-ball Pb-free flip-chip BGA package (0.8mm pitch), and the trailing letter “I” certifies that the device is qualified for Industrial operating junction temperature limits (-40°C to +100°C).
Q3: Can this chip natively run standard desktop operating systems like Ubuntu Linux?
A: Embedded and real-time Linux distributions tailored for ARMv7 architectures (such as PetaLinux or Yocto-project deployments) run perfectly on the embedded dual-core ARM Cortex-A9 processing sub-system. Standard PC x86 OS packages are not supported natively.
Q4: How can our engineering group request specific hardware development software tools (Vivado Design Suite), reference hardware files, or volume tier prices?
A: Please complete our Quick Inquiry web form on this page with details about your processing parameters. Our application support desk will process your inquiry and dispatch the available technical documentation package within 24 hours.
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