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SPC5674FMVY3

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SPC5674FMVY3

Part NumberSPC5674FMVY3
ManufacturerNXP Semiconductors
CategoryIntegrated Circuits (ICs) > Embedded – Microcontrollers
Description32-bit Power Architecture MCU, 264MHz e200z7 Core, 4MB Flash, 256KB RAM, Dual eTPU2, designed for high-performance automotive powertrain and mission-critical control systems.
Stock StatusIn Stock
OriginOriginal Factory

Product Overview

The SPC5674FMVY3 is a high-performance 32-bit automotive-grade MCU based on Power Architecture®, with a 264 MHz e200z7 core. Built for powertrain and real-time control systems, it integrates 4MB ECC Flash, 256KB SRAM, dual eTPU2, high-precision eQADC, and FlexCAN interfaces for deterministic closed-loop operation. Designed to withstand harsh conditions, it is ideal for automotive, aerospace, and mission-critical industrial applications.

Core Advantages

Blazing-Fast e200z7 Core with Dual FPU

Utilizes a high-frequency 264MHz 32-bit RISC core integrated with a pipelined Floating Point Unit (FPU) and SIMD instruction capabilities, allowing rapid native execution of multi-variable math control equations with zero application jitter.

Massive 4MB On-Chip Flash with Full ECC

Features an expansive 4MB embedded non-volatile Flash memory configuration secured by comprehensive Error Correction Code (ECC) technology, ensuring system stability and mitigating bit-flip risks in demanding harsh fields.

Dual Autonomous eTPU2 Coprocessors

Houses two standalone Enhanced Time Processor Units that handle timing-critical functions like multi-channel PWM generation, fuel injection control, and sensor decoding completely independent of the main CPU core to eliminate runtime bottlenecks.

Advanced Analog Acquisition Matrix (eQADC)

Integrates sophisticated queued analog-to-digital subsystems supporting up to 12-bit conversion resolution, enabling synchronized multi-channel hardware-driven sampling of external sensors without processing lag.

Key Specifications

BrandNXP Semiconductors
RoHS StatusRoHS Compliant / Lead-Free Standard
EDA/CAD Model3D Model & PCB Footprint Available upon request
Warranty1-Year Standard Factory Warranty
Package / CaseTEBGA-516 (27x27mm )
Mounting TypeSurface Mount Technology (SMD/SMT)
Surface Marking / SilkscreenSPC5674FMVY3 Marking
Core Subsystem32-bit Power Architecture® e200z7 Core Engine
Maximum Clock Frequency264 MHz Operating Clock Speed
On-Chip Program Flash4 MB Code Flash with ECC Protection
On-Chip System SRAM256 KB Total SRAM with ECC
Timer Subsystem2x eTPU2 (Enhanced Time Processor Units, 64 Channels total)
Analog-to-Digital ConverterDual eQADC Modules (Up to 12-bit resolution, multi-channel queued layout)
Network Interconnects3x FlexCAN (CAN 2.0B Active) Modules, Multiple LINflex and DSPI channels
Operating Voltage Supply1.2V Core Supply / 3.3V to 5.0V I/O and Analog Supply Rails
Operating Temperature Range-40°C to +125°C (AEC-Q100 Grade 1 Automotive System Qualification)

Typical Applications

  • Advanced Internal Combustion Engine Control Units (ECU) and Powertrain Management
  • Sophisticated Electronic Transmission Control Units (TCU) and Hybrid Vehicle Inverters
  • Heavy Industrial Multi-Axis Robotics, CNC Automation, and Precision Servo Control Systems
  • Commercial Aerospace Avionics Flight Controls, Telemetry Interfaces, and Engine Controllers
  • High-Reliability Marine Propulsion Control Arrays and Severe-Environment Military Equipment

Order & Shipping Info

Minimum Order Quantity (MOQ)1 Piece
Shipping TimeShipped within 1-2 business days
Delivery Time3-7 working days worldwide
Shipping MethodsDHL, UPS, FedEx, EMS
Payment MethodsT/T (Bank Transfer), PayPal, Credit Card, Western Union

Technical Support

For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.

Frequently Asked Questions

Q1: Is your current stock inventory of the SPC5674FMVY3 entirely genuine and brand-new?

A: Yes, we guarantee that all SPC5674FMVY3 microcontrollers in our stock are 100% brand-new, factory-original products, stored and handled in strict compliance with standard anti-static ESD shielding and moisture-sensitive device (MSL) guidelines.

Q2: What is the main design difference between the e200z7 core inside this MCU and smaller e200 cores?

A: The e200z7 core features a highly complex 10-stage instruction pipeline paired with a dual Floating Point Unit (FPU) and SIMD instruction capabilities. This gives it significantly higher raw processing efficiency and mathematical performance compared to lower-tier, single-issue e200z0 or e200z3 cores.

Q3: How does the 516-TEBGA package benefit thermal design inside an enclosed vehicle module?

A: The Thermally Enhanced Ball Grid Array (TEBGA) package features an embedded metal heat spreader layout. This structural element greatly reduces junction-to-case thermal resistance, helping dissipate core heat quickly into the PCB or exterior enclosure walls when operating at 264 MHz.

Q4: How can our technical group request complete register maps, pin-out reference sheets, or custom volume pricing grids?

A: Please complete our Quick Inquiry web form on this page with details about your processing parameters. Our application support desk will process your inquiry and dispatch the available technical documentation package within 24 hours.

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