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XC7K70T-2FBG676C
XC7K70T-2FBG676C
| Part Number | XC7K70T-2FBG676C |
|---|---|
| Manufacturer | AMD / Xilinx |
| Category | Integrated Circuits (ICs) > Embedded – FPGAs (Field Programmable Gate Array) |
| Description | AMD Xilinx XC7K70T-2FBG676C Kintex-7 FPGA, 28nm HKMG low-power process, 65600 logic cells, 300 I/O, 4×10.3125Gbps GTX transceivers, 27×27mm 676FCBGA commercial grade chip. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The XC7K70T-2FBG676C is a high-performance Field Programmable Gate Array (FPGA) from AMD/Xilinx Kintex®-7 product family. Built on advanced 28nm HKMG manufacturing process, it balances high-speed signal processing performance and low static/dynamic power consumption perfectly.
Equipped with 65,600 logic cells and 300 configurable user I/Os, this chip delivers outstanding cost-performance ratio to satisfy high-bandwidth data processing demands without extra system cost overhead. This -2 speed grade variant is packaged in a 676-pin FCBGA (27×27mm) form factor.
It integrates abundant embedded block RAM, high-speed GTX serial transceivers, and dedicated hard IP blocks, supporting ultra-high serial throughput and seamless system integration for communication infrastructure, medical imaging, industrial control and professional broadcast equipment.
Core Advantages
Optimized Price-to-Performance Ratio
The Kintex-7 family delivers up to a 2X improvement in price-performance over previous generations, allowing system architects to implement high-end functionality at price points previously reserved for high-volume, lower-density architectures.
Advanced 28nm Low-Power Technology
Utilizing state-of-the-art 28nm processing logic, the device consumes significantly lower static and dynamic power while maximizing performance, making it ideal for thermally constrained and energy-sensitive operating environments.
High-Speed Transceiver Integration
Equipped with integrated GTX transceivers supporting data rates up to 10.3125 Gbps, the XC7K70T-2FBG676C enables rapid data transfer capabilities, robust serial connectivity, and high-bandwidth interfacing with external peripherals.
Rich Hard IP Elements
Features a built-in PCI Express® (PCIe) Gen2 block, integrated Analog Mixed Signal (AMS / XADC) blocks, and powerful clock management tiles (CMTs) that dramatically reduce external component count and accelerate time-to-market.
Key Specifications
| Brand | AMD / Xilinx |
|---|---|
| RoHS | RoHS Compliant / Lead-Free |
| EDA/CAD Model | Available (3D Models, PCB Footprints & Schematics) |
| Warranty | 12 Months Manufacturer Warranty |
| Package / Case | 676-BBGA / FCBGA (27×27 mm) |
| Mounting Type | Surface Mount (SMD/SMT) |
| Surface Marking | XC7K70T-FBG676 Marking |
| Number of Logic Elements | 65,600 Logic Cells |
| Number of LABs / CLBs | 8,200 Configurable Logic Blocks (CLBs) |
| Total RAM Bits | 4,976,640 Bits (4.75 Mbit Embedded Block RAM) |
| Number of I/O Lines | 300 User Configurable I/O |
| Voltage – Supply (VCCINT Core) | 0.97V ~ 1.03V (1.0V nominal, ±3% tolerance) |
| I/O Voltage Range | 1.14V ~ 3.465V (Supports 1.2V to 3.3V single-ended interfaces) |
| Operating Temperature | Ambient TA: 0°C ~ +85°C Commercial Grade; Continuous Operating Max Junction TJ: +100°C, Absolute Max TJ: +125°C |
| Speed Grade | -2 Mid-to-High Performance Speed Grade |
| GTX High-Speed Transceivers | 4 integrated GTX serial high-speed transceivers |
| Max Serial Transceiver Rate | Up to 10.3125 Gbps per GTX channel |
| CMT Clock Management Tiles | 4 clock management tiles with PLL & MMCM modules |
| Built-in XADC Analog Module | Dual-channel 12-bit analog-to-digital converter for voltage/temp monitoring |
| PCIe Hard IP Support | Integrated PCI Express Gen 2 hard IP core |
| Storage Temperature Range | -65°C ~ +150°C long-term storage temperature limit |
| Absolute Max Junction Temperature | +125°C instantaneous peak junction temperature limit |
Typical Applications
- Wireless Communications: LTE base stations, cellular backhaul systems, radio units, and software-defined radios (SDR).
- Aerospace & Defense: Ruggedized computing platforms, radar processing, secure communications, and avionics guidance systems.
- Industrial Automation & Vision: Machine vision systems, high-end motor controllers, factory automation tools, and multi-axis robotics.
- Medical Electronics: Portable and console-based ultrasound systems, high-resolution diagnostic imaging scanners, and patient monitoring equipment.
- Broadcast & Video: Real-time professional video processing, 4K/8K frame grabbers, video over IP bridging, and broadcast switches.
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet access, official documentation, sample requests, current inventory check, or bulk wholesale pricing configurations, please use our online Quick Inquiry form. Our dedicated engineering and global sales support teams will review your technical requirements and reply within 24 hours.
Frequently Asked Questions
Q1: Is the XC7K70T-2FBG676C a factory-original component?
A: Yes, all devices supplied are 100% brand new, authentic, sourced directly from original manufacturer or authorized distribution channels.
Q2: What is the main difference between the -2 and other speed grades?
A: The “-2” designator denotes a mid-to-high performance speed grade within the Kintex-7 classification. It delivers faster internal switching and propagation delay vs -1 grade, suitable for strict high-speed timing constraints.
Q3: What software development tools are used to program this device?
A: This FPGA is fully supported by AMD/Xilinx’s Vivado® Design Suite, covering complete HDL synthesis, implementation, simulation, and hardware debugging workflows.
Q4: How do you ensure product quality before shipping?
A: All components are stored in ESD-controlled warehouses and pass strict outgoing QC, full visual inspection, and moisture-barrier anti-oxidation packaging before dispatch.
Q5: What is the MOQ and delivery lead time?
A: MOQ is 1 piece for spot stock orders. In-stock goods ship out within 1–2 working days, global delivery takes 3–7 days via DHL/UPS/FedEx.
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