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AS4C32M16SB-7TIN

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AS4C32M16SB-7TIN

Part NumberAS4C32M16SB-7TIN
ManufacturerAlliance Memory, Inc.
CategoryIntegrated Circuits (ICs) > Memory – SDRAM
Description512Mbit High-Speed Synchronous DRAM (SDRAM) organized as 4 Banks x 8M x 16-bit, featuring a 143MHz clock frequency, 3.0V~3.6V power supply, and industrial operating temperature range, housed in a 54-pin TSOP II package.
Stock StatusIn Stock
OriginOriginal Factory

Product Overview

The AS4C32M16SB-7TIN is a high-density SDRAM from Alliance Memory. With a 512Mbit capacity structured as 4 Banks × 8M × 16-bit, it runs up to 143MHz and supports CAS latency 2/3, plus LDQM/UDQM byte mask control. Fully synchronous clock design eliminates bus skew. Packaged in 54-pin TSOP II, it meets industrial temperature standards for automotive, industrial control and network equipment.

Core Advantages

Optimized High-Speed Bandwidth

143MHz high clock frequency delivers low-latency bandwidth for video cache and network routing.

Multi-Bank Concurrent Operation

4-bank interleaving hides row precharge delay for heavy computing scenarios.

Industrial Wide Temperature Resistance

Reliable operation from -40℃ to +85℃, suitable for medical, aerospace and factory automation.

Long Product Lifecycle Support

Extended manufacturing supply avoids early component obsolescence for embedded systems.

Key Specifications

BrandAlliance Memory, Inc. High-Speed SDR SDRAM Family
RoHS StatusRoHS3 Compliant / Lead-Free / Green Halogen-Free Materials Verified (“N” Suffix)
EDA/CAD Model3D STEP Models, Schematic Symbols, and Pinout Footprint Configurations available upon request
Warranty1-Year Standard Quality Warranty
Package / Case54-pin TSOPII
Package Dimension10.29mm
Mounting TypeSurface Mount
Surface Marking / SilkscreenAS4C32M16SB-7TIN Marking
Memory Density512 Mbit (536,870,912 Bits total capacity)
Configuration Organization32 Meg × 16 (4 Banks × 8,388,608 Words × 16 Bits)
Clock Frequency Threshold143 MHz Max Core Operation Frequency (-7 Speed Grade)
Access Time from CLK5.4 ns maximum data access speed at CAS Latency 3
Programmable ParametersBurst Length (1, 2, 4, 8, or Full Page) and CAS Latency (2 or 3)
Memory Refresh Cycle8K Refresh Cycles per 64 ms time interval, auto self-refresh support
Operating Voltage Supply3.0 V ~ 3.6 V Analog and Digital Signal Rail Voltages (VDD / VDDQ)
I/O Logic LevelLVTTL Compatible I/O Interface
Operating Temperature Range-40°C to +85°C Extended Industrial Operational Limits (TA)
Moisture Sensitivity LevelMSL 3 (168 Hours Floor Life at 30°C / 60% RH)
Core ArchitectureHigh-speed CMOS Synchronous DRAM, Concurrent Multi-Bank Operation
Typical Use CaseHigh-bandwidth embedded industrial, automotive, network communication equipment

Typical Applications

  • Industrial PLC Automation Systems, HMIs, and Edge-Compute Control Panels
  • Automotive Dashboard Telematics, Rear-View Camera Buffers, and Navigation Arrays
  • Commercial Networking Gateways, Cellular Base Station Routers, and Broadband Converters
  • Medical Vital Sign Monitors, Diagnostic Ultrasound Hardware, and Telemetry Systems
  • Consumer Electronic Media Players, High-Definition Smart Televisions, and Set-Top Boxes

Order & Shipping Info

Minimum Order Quantity (MOQ)1 Piece
Shipping TimeShipped within 1-2 business days
Delivery Time3-7 working days worldwide
Shipping MethodsDHL, UPS, FedEx, EMS
Payment MethodsT/T (Bank Transfer), PayPal, Credit Card, Western Union

Technical Support

For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.

Frequently Asked Questions

Q1: Are AS4C32M16SB-7TIN chips 100% original new?

A1: All stock chips are genuine factory-new from Alliance Memory. We store memory components in ESD clean areas with original anti-static JEDEC trays and desiccants to avoid package cracking during reflow soldering.

Q2: What does suffix “7TIN” stand for?

A2: 7 = 143MHz speed grade, 5.4ns access time; T = 54-pin TSOP II package; I = industrial temp range -40℃~+85℃; N = lead-free RoHS3 green material.

Q3: What advantages does 32M×16 architecture bring?

A3: 16-bit bus fits ARM 16/32-bit MCUs. It doubles bandwidth vs 8-bit SDRAM and cuts PCB routing traces compared with 32-bit wide memory, lowering board cost.

Q4: What are LDQM and UDQM pins used for?

A4: They are upper/lower 8-bit data mask pins for 16-bit bus. Pull high to mask corresponding IO ports and avoid byte write/read data corruption. Contact us for timing schematic files.

Q5: What is the delivery lead time for this model?

A5: In-stock items ship within 1-2 working days; bulk large orders take 7-15 days based on quantity.

Q6: Can I get free samples for testing?

A6: Small test samples are available, just submit demands through the inquiry form with your project info.

Q7: How should I store unused SDRAM chips?

A7: Keep sealed with desiccant under MSL3 storage rules; if opened over 168 hours, bake before SMT reflow to prevent moisture damage.

Q8: Is there any compatible alternative memory chip?

A8: We offer cross-reference SDRAM models with same capacity and package, send your board specs for matching recommendation.

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