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SCB13H4G160AF-11MI
SCB13H4G160AF-11MI
| Part Number | SCB13H4G160AF-11MI |
|---|---|
| Manufacturer | UnilC Semiconductors (Formerly Xi’an SinoChip / SinoIC) |
| Category | Integrated Circuits (ICs) > Memory > DDR3L SDRAM |
| Description | 4Gb (256M × 16) High-Speed DDR3L SDRAM, 1866 Mbps, 1.35V/1.5V, Industrial Grade, 96-FBGA Package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
SCB13H4G160AF-11MI is a high-density 4Gbit DDR3L SDRAM from UnilC. Built with 8 internal memory banks and 16-bit data bus, it supports up to 1866 Mbps bandwidth for embedded, industrial, network and automotive equipment. It runs on low 1.35V voltage with backward compatibility to 1.5V DDR3, meets industrial temperature specs, and adopts compact 96-ball FBGA package with stable signal performance.
Core Advantages
High 1866 Mbps Bandwidth
Maximize data transmission speed and improve system response for data-heavy scenarios.
Low-Voltage Energy Saving
1.35V native operation cuts power consumption by 20% vs 1.5V DDR3, compatible with standard 1.5V power supply.
16-bit Wide Bus Design
Reduce external memory chips and save PCB layout space with wide parallel interface.
Industrial Grade Stability
Stable performance between -40℃ ~ +95℃, reliable for harsh industrial working environments.
Key Specifications
| Brand | UnilC Memory Series |
|---|---|
| Full Part Number | SCB13H4G160AF-11MI |
| Device Type | 4Gbit DDR3L SDRAM Low Voltage Memory Chip |
| RoHS Status | RoHS Compliant / Lead-Free / Green Package |
| EDA/CAD Model | Schematic symbol models, 3D CAD step profiles, and 96-ball FBGA land patterns are available on request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 96-FBGA (13.50 mm × 7.50 mm × 1.20 mm) |
| Mounting Type | Surface Mount (SMT / SMD) |
| Surface Marking / Silkscreen | SCB13H4G160AF-11MI Marking |
| Memory Architecture | DDR3L SDRAM (Low Voltage Double Data Rate 3) |
| Density & Organization | 4 Gb (Organized as 8 Banks × 32M × 16 bits) |
| Max Clock Frequency | 933 MHz (1866 Mbps Data Rate) |
| Supported Data Rate | 1600 Mbps / 1866 Mbps / 2133 Mbps (Corresponding Clock: 800/933/1066MHz) |
| Speed Bin / Timing Grade | -11M (DDR3L-1866 / CL13 Latency Specification) |
| Compatible Timing Grade | DDR3-2133 (CL14), DDR3-1866 (CL13), DDR3-1600 (CL11) |
| Operating Voltage (VDD / VDDQ) | 1.35V (1.283V to 1.45V) / 1.5V (1.425V to 1.575V Compatible) |
| Interface Signaling Standard | SSTL_135 (1.35V) / SSTL_15 (1.5V) Stub Series Terminated Logic |
| Burst Length Support | BL8 or BC4 (Burst Chop) Programmable |
| Internal Architecture | 8 Independent Memory Banks, 8-bit Pre-fetch Architecture |
| On-Chip Core Function | ODT On-Die Termination, DM Data Mask, Write Leveling, Self-Refresh Mode |
| Signal Input Design | Differential Clock Input (CK, CKB) & Differential Bidirectional Data Strobe (DQS) |
| Programmable Parameter | Adjustable CAS Read Write Latency (CL/CWL), Full Mode Register Configuration |
| Temperature Adaptive Refresh Rule | ≤85℃: 64ms / 8192 refresh cycles; >85℃: 32ms shortened refresh period |
| Operating Temperature Range | -40℃ to +95℃ (Industrial Grade Specification) |
| Storage Temperature Range | -55℃ ~ +125℃ |
| Typical Operating Current | 280mA @ 1866Mbps, 1.35V |
| Self-Refresh Standby Current | ≤12mA |
Typical Applications
- Industrial automation controllers, programmable logic controllers (PLCs), and rugged human-machine interfaces (HMI)
- Enterprise networking routers, hardware firewalls, high-speed switches, and wireless access base stations
- Embedded single-board computers (SBC), IoT edge computing gateways, and machine vision processors
- Automotive infotainment display modules, digital instrument clusters, and advanced driver-assistance systems (ADAS)
- High-definition surveillance IP cameras, digital video recorders (NVR/DVR), and smart medical monitoring units
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: What does suffix -11MI stand for in SCB13H4G160AF-11MI?
A: -11 = max clock speed grade for DDR3L-1866; M = internal wafer revision; I = industrial temp range (-40℃ ~ +95℃).
Q2: Can this chip work on standard 1.5V DDR3 mainboards?
A: Yes. Dual voltage design supports native 1.35V low-power mode and 1.5V standard mode without hardware damage.
Q3: What advantages does 256M×16 layout bring to embedded devices?
A: 16-bit parallel bus only requires two chips to build 32-bit memory bus, saving PCB space and simplifying wiring vs x8 memory particles.
Q4: What refresh modes guarantee data stability under industrial temperature?
A: Auto Refresh & Self Refresh supported. Above 85℃, refresh cycle auto shortens to 3.9μs to keep complete data storage.
Q5: What equipment is this DDR3L chip widely used in?
A: Industrial control boards, network switches, automotive main control units, embedded single-board computers, monitoring devices.
Q6: Is there commercial temperature version available for this model?
A: Yes. The suffix -MC version is 0℃~85℃ commercial grade, lower cost for indoor consumer equipment.
Q7: Can you provide free samples for performance testing?
A: We support small sample orders for customer verification; bulk orders enjoy discounted sample reimbursement policy.
Q8: Does the chip support ODT on-die termination function?
A: Built-in adjustable ODT, effectively reduce signal reflection and improve high-speed signal integrity at 1866Mbps.
Q9: What is the lead time for mass stock orders?
A: Standard in-stock items ship within 3-5 working days; out-of-stock bulk orders take 2-4 weeks production lead time.
Q10: Is this FBGA chip RoHS lead-free compliant?
A: Fully RoHS green packaging, no harmful heavy metals, meets global electronics environmental standards.
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