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THGBMFG6C1LBAIL
THGBMFG6C1LBAIL
| Part Number | THGBMFG6C1LBAIL |
|---|---|
| Manufacturer | Kioxia (Formerly Toshiba Memory) |
| Category | Integrated Circuits (ICs) > Memory – eMMC (Embedded MultiMediaCard) |
| Description | 8GB eMMC 15nm MLC NAND Flash Memory, High-Performance JEDEC Interface, 3.3V/1.8V Supply, 153-FBGA Package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The THGBMFG6C1LBAIL is an advanced 8GB eMMC non-volatile storage solution manufactured by Kioxia (formerly Toshiba Memory). Built on proven 15nm MLC NAND Flash technology, this single-package device integrates high-speed flash memory and dedicated controller, fully compliant with JEDEC eMMC 4.41 standards. It offloads memory management tasks including ECC, wear leveling and bad block handling from host processors. With dual voltage rails for core and I/O operation, it delivers fast data transfer, low power consumption and stable long-term storage. Packaged in compact 153-FBGA form factor, it suits communication equipment, industrial automation, automotive electronics and smart IoT devices.
Core Advantages
Integrated Autonomous Memory Management
Built-in flash controller automatically executes ECC correction, wear leveling and bad block management, lowering host workload and accelerating software development.
Advanced 15nm MLC NAND Technology
Adopts mature 15nm fabrication process, balancing high storage density, reliable read/write performance and power efficiency within small packaging size.
Standard JEDEC eMMC 4.41 Interface
Conforms to JEDEC eMMC 4.41 specification, supporting rapid data access to ensure smooth operation for embedded operating systems.
Compact 153-FBGA Package & High Reliability
Industry-standard 153-FBGA packaging features strong vibration resistance, ideal for space-limited PCB layout designs.
Key Specifications
| Brand | Kioxia / Toshiba |
|---|---|
| RoHS Status | RoHS Compliant / Lead-Free / Halogen-Free |
| EDA/CAD Model | Schematic symbol models, 3D CAD step profiles, and 153-FBGA footprint land patterns are available on request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 153-FBGA (11.5 mm × 13.0 mm × 0.8 mm, 0.5mm Ball Pitch) |
| Mounting Type | Surface Mount (SMT / SMD) |
| Surface Marking / Silkscreen | THGBMFG6C1LBAIL Marking |
| Memory Capacity | 8 Gigabytes (8GB / 64 Gbits) |
| Flash Type | MLC NAND Flash |
| Technology Node | 15nm Process |
| eMMC Interface Standard | JEDEC eMMC 4.41 |
| Bus Width | 1-bit, 4-bit, or 8-bit Parallel Data Bus |
| Max Clock Frequency | 52MHz |
| Device Structure | MCM Multi-Chip Module |
| Built-in Functions | ECC Correction, Wear Leveling, Bad Block Management, Garbage Collection |
| NAND Supply Voltage (VCC) | 2.7V to 3.6V (3.3V Nominal) |
| I/O Supply Voltage (VCCQ) | 1.7V to 1.95V (1.8V Nominal) or 2.7V to 3.6V (3.3V Nominal) |
| Operating Temperature Range | 0°C to +70°C (Commercial Grade); Selected batches support extended temperature -25°C ~ +85°C |
| Production Status | Obsolete, Continued by Kioxia |
Typical Applications
- Embedded Linux / Android system boot and main storage for industrial single-board computers (SBCs)
- Smartphones, tablet PCs, e-readers, and portable digital multimedia players
- Automotive infotainment systems, telematics control units, and digital dashboards
- Smart home controllers, OTT set-top boxes, smart TVs, and IP security surveillance hardware
- Commercial Point-of-Sale (POS) terminals, handheld barcode scanners, and medical instrumentation
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: What does the product code “THGBMFG6C1LBAIL” represent?
A1: In Kioxia/Toshiba’s eMMC naming scheme, “TH” stands for Kioxia/Toshiba memory, “GBM” specifies eMMC product line, “FG6” indicates 8GB capacity built on 15nm technology, “C1” represents the internal die/controller generation, and “LBAIL” designates the 153-ball FBGA package type.
Q2: How does the THGBMFG6C1LBAIL ensure data protection during abrupt power outages?
A2: The device features specialized power-failure handling firmware and hardware protection mechanisms that safely write critical data buffers to non-volatile memory and prevent flash table corruption upon sudden power loss.
Q3: Is THGBMFG6C1LBAIL pin-compatible with other standard 153-ball eMMC devices?
A3: Yes, it strictly adheres to the standard JEDEC 153-ball FBGA footprint (11.5 mm × 13.0 mm with 0.5mm ball pitch), enabling direct drop-in replacement and PCB compatibility with standard 153-ball eMMC packages.
Q4: Can this device be used as the primary OS boot drive for embedded ARM or x86 processors?
A4: Absolutely. The THGBMFG6C1LBAIL includes dedicated JEDEC-compliant hardware boot partitions, allowing host processors to seamlessly boot operating systems such as Linux, Android, or RTOS directly from the device.
Q5: Which eMMC specification does THGBMFG6C1LBAIL comply with?
A5: It fully complies with JEDEC eMMC 4.41 standard, not eMMC 5.1. Please confirm protocol matching before hardware design.
Q6: What is the operating temperature range of THGBMFG6C1LBAIL?
A6: Standard temperature range is 0°C ~ +70°C (Commercial Grade). Selected batches support extended temperature -25°C ~ +85°C, confirm stock specifications before ordering.
Q7: Is THGBMFG6C1LBAIL still in mass production?
A7: This model is obsolete, the product line is inherited by Kioxia. We supply available inventory stock.
Q8: What built-in functions are integrated inside this eMMC chip?
A8: The internal controller supports automatic ECC correction, wear leveling, bad block management and garbage collection, reducing development burden for main processors.
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