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NT5CC256M16ER-EK
NT5CC256M16ER-EK
| Part Number | NT5CC256M16ER-EK |
|---|---|
| Manufacturer | Nanya Technology |
| Category | Integrated Circuits (ICs) > Memory – DRAM |
| Description | 4 Gigabit (256M x 16-Bit) DDR3L Low Voltage Synchronous DRAM, 1866Mbps (DDR3L-1866 / 13-13-13), 1.35V, 96-Ball FBGA Package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The NT5CC256M16ER‑EK is a 4Gb DDR3L low‑voltage SDRAM from Nanya, organized as 256M x 16‑Bit. It supports DDR3L‑1866 (933MHz) with 1.35V supply, backward‑compatible with 1.5V DDR3. Adopting 8n‑prefetch architecture, it delivers high bandwidth for embedded, networking, surveillance and consumer devices, housed in 96‑Ball FBGA package.
Core Advantages
Energy‑Efficient 1.35V DDR3L Technology
1.35V operating voltage, lower power consumption, fully compatible with 1.5V DDR3 systems.
High‑Speed DDR3L‑1866 Performance
1866Mbps data rate with 13‑13‑13 CAS latency, delivers high bandwidth for high‑speed data processing.
High‑Density x16 Bus Architecture
256M x16‑bit density in single die, simplifies PCB layout and reduces component count.
Advanced Signal Integrity & Calibration
Integrated ODT, ZQ Calibration and Write‑Leveling for stable high‑speed signal transmission.
Key Specifications
| Brand | Nanya Technology |
|---|---|
| RoHS Status | RoHS Compliant / Lead‑Free / Halogen‑Free |
| EDA / CAD | PCB Footprint & 3D Model Available upon Request |
| Warranty | 1‑Year Standard Quality Warranty |
| Package / Case | 96‑Ball FBGA (8.00 x 13.00mm,0.8mm Ball pitch) |
| Mounting Type | Surface Mount Device (SMD/SMT) |
| Surface Marking / Silkscreen | NT5CC256M16ER‑EK Marking |
| Memory Type / Format | DDR3L SDRAM (Low Voltage) |
| Memory Density | 4 Gb (4 Gigabits) |
| Organization | 256M x 16‑Bit |
| Speed Grade / Frequency | DDR3L‑1866 (933 MHz Clock Frequency) |
| Supply Voltage (VDD / VDDQ) | 1.35V (1.283V to 1.45V) / 1.5V Compatible |
| Operating Temperature | 0°C to +95°C (Commercial Temperature) |
| Internal Banks | 8 Banks |
| Burst Length | BL8 / BC4 / BC4 (On‑the‑fly configurable) |
| Key Features | ODT, ZQ Calibration, Write‑Leveling, Self‑Refresh, Power‑Down Mode |
| Interface Standard | JEDEC DDR3L SDRAM Specification |
Typical Applications
- Networking and Communications (Routers, Switches, and Gateways)
- Smart TVs, Digital Set‑Top Boxes (STB), and Home Entertainment Centers
- Automotive Infotainment, Telematics, and Dashboards
- Security Video Surveillance (DVR / NVR / IP Cameras)
- Industrial IoT Gateways, Automation Controllers, and Single Board Computers
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1‑2 business days |
| Delivery Time | 3‑7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: What is the difference between NT5CC256M16ER‑EK and NT5CB256M16DP‑EK?
A: NT5CC is DDR3L low‑voltage (1.35V). NT5CB is standard DDR3 (1.5V). Both share 256M×16‑bit density and 96‑ball FBGA footprint. DDR3L can run at 1.5V, but standard DDR3 cannot work at 1.35V.
Q2: Can NT5CC256M16ER‑EK work at 1.5V DDR3 voltage?
A: Yes. This DDR3L chip is backward‑compatible, and supports 1.5V power supply for legacy DDR3 system designs.
Q3: What performance does the “-EK” suffix represent?
A: “-EK” stands for DDR3L‑1866 speed grade, with 1866Mbps data rate and 13‑13‑13 CAS latency.
Q4: What does the “ER” die suffix mean in NT5CC256M16ER‑EK?
A: “ER” is the E‑die revision for 4Gb 256M×16‑bit DDR3L. Different die suffixes cause minor power‑mode differences, but pin‑out and PCB footprint remain identical.
Q5: What are pin‑to‑pin compatible replacement models?
A: Nanya direct alternative: NT5CC256M16ER‑EJ (DDR3L‑1600). Micron equivalent: MT41K256M16HA‑125:A (DDR3L‑1866). Lower‑speed chips can be drop‑in substitutes, but bandwidth will decrease. Verify memory controller timing before mass production.
Q6: What are the temperature suffix variants for NT5CC256M16ER series?
A: ‑EK: Commercial grade (0~95°C). ‑ET: Quasi‑industrial grade (-40~95°C). ‑EI: Full‑industrial grade (-40~95°C). Industrial versions cannot be directly substituted without thermal reliability evaluation.
Q7: What is the difference between FBGA‑96 and TFBGA‑96 package?
A: FBGA‑96 and TFBGA‑96 are the same physical package. TFBGA is the thin‑profile naming used by LCSC. They have identical ball‑map, pin‑out and PCB footprint, fully interchangeable.
Q8: Can NT5CC256M16ER‑EK replace NT5CC256M16EQ‑EK?
A: NT5CC256M16EQ‑EK uses F‑die, while ER uses E‑die. Both are 4Gb 256M×16‑bit DDR3L‑1866 with same 96‑ball FBGA footprint. Minor power‑consumption difference, pin‑to‑pin compatible for most circuits. Please check datasheet for power‑mode settings.
Q9: How to get datasheet, footprint files or quotation?
A: You can request datasheet, PCB footprint, stock check and volume pricing through our Quick Inquiry form.
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