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HI3519ARFCV100
HI3519ARFCV100
| Part Number | HI3519ARFCV100 |
|---|---|
| Manufacturer | Hisilicon |
| Category | Integrated Circuits (ICs) > Embedded – Microcontrollers / System-on-Chip (SoC) |
| Description | Ultra‑HD 4K Smart IP Camera SoC, H.265/H.264 Encoder, Dual Neural Network Engine (NNIE), BGA Package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The HI3519ARFCV100 (Hi3519AV100) is a 4K Ultra‑HD SoC for IP cameras and edge‑AI applications. Equipped with dual‑core Cortex‑A53, Cortex‑M7, dual‑NNIE accelerator, 4th‑gen ISP and 4K@60fps H.265/H.264 encoding, it serves security, transportation and panoramic vision systems. Note: ARFCV100 is a channel‑customized variant; hardware matches Hi3519AV100, reference docs & SDK follow Hi3519AV100 specs.
Core Advantages
Dual Neural Network Intelligent Engine (NNIE)
Dual‑hardware NNIE delivers 2.0 TOPS INT8 AI performance, supporting edge object detection, target tracking and behavioral analysis.
4K Ultra‑HD Video Encoding & Processing
Supports 4K@60fps multi‑channel H.265/H.264/MJPEG encoding. Max bitrate: H.265‑120Mbps, H.264‑200Mbps, optimizing bandwidth and storage.
Industry‑Leading Fourth‑Generation ISP Engine
Integrated 3DNR, multi‑exposure WDR, distortion correction, 6‑axis EIS and hardware‑accelerated panoramic stitching for high‑quality imaging under varied lighting.
Flexible Multi‑Sensor & Peripheral Interface
Up to 5‑channel sensor input (MIPI‑CSI2 / Sub‑LVDS / HiSPi / SLVS‑EC). Rich high‑speed interfaces: PCIe2.0, USB3.0, Gigabit Ethernet, HDMI2.0, MIPI‑DSI and built‑in audio codec.
Key Specifications
| Brand | Hisilicon |
|---|---|
| RoHS Status | RoHS Compliant / Lead‑Free |
| EDA / CAD | PCB Footprint & 3D Model Available upon Request |
| Warranty | 1‑Year Standard Quality Warranty |
| Package / Case | BGA |
| Mounting Type | Surface Mount Device (SMD/SMT) |
| Surface Marking / Silkscreen | Hi3519ARFCV100 Marking |
| CPU Architecture | Dual‑Core ARM Cortex‑A53 @1.5GHz + ARM Cortex‑M7 Real‑Time Core; 32KB I/D Cache + 256KB L2 Cache, Neon/FPU acceleration |
| AI Accelerator | Dual Hardware NNIE (Neural Network Intelligent Engine), Total 2.0 TOPS (INT8) |
| Video Encoding Performance | 4K @ 60fps / 8MP Real‑Time Encoding (H.265 / H.264 / MJPEG); Max bitrate: H.265 120Mbps, H.264 200Mbps |
| Sensor Interfaces | MIPI‑CSI2, Sub‑LVDS, HiSPi, SLVS‑EC; support up to 5‑channel sensor input |
| Memory Support | 32‑bit DDR4 / LPDDR4 / DDR3 Interfaces, max frequency 1333MHz, maximum addressable 3.5GB |
| High‑Speed Connectivity | PCIe 2.0, USB 3.0 / USB 2.0, GbE MAC, SDIO 3.0, HDMI 2.0 Output, 4‑lane MIPI‑DSI, BT.656/BT.1120 parallel port |
| Operating Temperature | 0°C ~ +70°C (Commercial Grade) |
| Storage Temperature | -55 ℃ ~ +125 ℃ |
| Power Consumption | Typical 1.9‑2.2W (4K encoding + AI workload); Core 0.8V, IO 1.8V / 3.3V |
| OS & SDK Support | Linux‑based SDK, supports OpenHarmony adaptation |
| Peripheral Resources | 9×UART, multiple I2C / SPI / PWM, built‑in Audio Codec (I2S/TDM), SPI Nor/Nand Flash interface |
Typical Applications
- Ultra‑HD 4K Smart Security IP Cameras (Bullet, Dome, and PTZ Cameras)
- Intelligent Transportation System (ITS) & License Plate Recognition (LPR) Cameras
- Multi‑Lens Panoramic & 360‑Degree Surround View Cameras
- High‑End Drone (UAV) Aerial Imaging & Action Cameras
- Edge AI Vision Terminals, Smart Retail Analytics, and Industrial Machine Vision
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1‑2 business days |
| Delivery Time | 3‑7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: What is the maximum video resolution of HI3519ARFCV100?
A: It supports real‑time 4K@60fps encoding with H.265/H.264 codecs for Ultra‑HD video output.
Q2: Does HI3519ARFCV100 support edge AI inference?
A: Yes, dual‑NNIE hardware accelerator delivers 2.0 TOPS INT8 performance for local object detection, tracking and analytics.
Q3: Can this chip handle multiple camera sensor inputs?
A: Yes, up to 5‑channel sensor inputs via MIPI‑CSI2 / Sub‑LVDS / HiSPi / SLVS‑EC for panoramic and multi‑lens designs.
Q4: Where can I get datasheet, SDK or quotation for HI3519ARFCV100?
A: Request documents, SDK, stock check and volume pricing via our inquiry form. ARFCV100 is channel‑customized, refer to Hi3519AV100 specs.
Q5: What are pin‑to‑pin compatible replacement parts?
A: Drop‑in compatible variants: HI3519AV100, HI3519RBCV100, HI3519RFCV100. Same die, package and pin‑out; suffixes are channel‑batch identifiers.
Q6: What does suffix “ARFCV100” mean in part number?
A: ARFCV100 is a channel‑customized suffix from Hisilicon. Core die is identical to Hi3519AV100; datasheet & SDK follow Hi3519AV100.
Q7: What is the difference between HI3519ARFCV100 and Hi3559AV100?
A: Hi3559AV100 supports 8K video, higher 4‑TOPS NNIE and 64‑bit memory. HI3519ARFCV100 is 4K‑oriented with lower power and cost for mainstream IP cameras.
Q8: Is OpenHarmony supported on HI3519ARFCV100?
A: Yes, OpenHarmony can be ported based on the official Linux SDK for edge‑AI terminal development.
Q9: What is the maximum supported memory capacity?
A: 32‑bit memory interface only, max addressable memory is 3.5GB. 64‑bit memory is not supported.
Q10: What are competitive alternative SoCs?
A: Main alternatives: Rockchip RK3568, RK3588, Ambarella CV22, HiSilicon Hi3519DV500. Please check datasheets for project selection.
Q11: What is FCCSP‑840 package?
A: FCCSP‑840 is a distributor‑used naming; official datasheet does not mark this ball‑count suffix. Actual package: FCCSP 15 mm×15 mm mixed‑ball‑pitch flip‑chip package.
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