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XC2S150E-6FG456C
XC2S150E-6FG456C
| Part Number | XC2S150E-6FG456C |
|---|---|
| Manufacturer | AMD Xilinx |
| Category | Integrated Circuits (ICs) > Embedded – FPGAs (Field Programmable Gate Array) |
| Description | Spartan-2E family platform FPGA featuring 150,000 system gates, 3,888 logic cells, integrated distributed and block RAM, and extensive multi-voltage I/O support in a 456-pin Fine-Pitch BGA package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The XC2S150E-6FG456C is a low-cost AMD Xilinx Spartan-2E FPGA for low-power mass-production electronics, industrial and communication equipment.
Built on 0.18μm 1.8V core process, it provides 150,000 system gates and 3,888 logic cells for custom digital control circuits.
Its built-in SelectIO™ multi-voltage I/O supports 19 signal standards, eliminating extra level-shifting chips for mixed-voltage system design.
On-chip Block RAM & distributed RAM cut external cache latency. This commercial-grade 456-FBGA chip delivers stable low-power performance for global logic control and protocol conversion projects.
Core Advantages
Multi-Voltage SelectIO™ Interface
Supports 19 single-ended/differential signal standards, enabling direct chip-to-chip connection and simplified PCB layout without extra level-shifting hardware.
Dual Embedded Memory Architecture
Combines dual-port Block RAM and CLB distributed RAM to realize fast local cache, deep pipeline FIFO and low-latency state machine operation.
Low-Power 0.18μm Process
The optimized 0.18μm silicon process reduces static & dynamic power draw, lowering overall system heat dissipation requirements.
4 Independent DLL Clock Modules
Onboard digital DLLs support clock multiplication, division and zero-delay global clock distribution for precise synchronous timing.
Key Specifications
| Brand | AMD Xilinx® FPGA Series |
|---|---|
| RoHS Status | RoHS Compliant, Lead-Free Termination (FBGA package with tin finish) |
| EDA/CAD Model | 3D STEP Models, Schematic Symbols, and Pinout Footprint Configurations available upon request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 456-FBGA (23mm × 23mm × 1.00mm) |
| Mounting Type | Surface Mount Technology (SMD/SMT Lead Reflow Solder Assembly) |
| Surface Marking / Silkscreen | XC2S150E FG456 Marking |
| Total System Gates | 150,000 System Gates available for programmatic integration |
| Logic Cells Count | 3,888 Logic Cells (arranged via Configurable Logic Blocks) |
| CLB Quantity | 864 Configurable Logic Blocks (CLBs) |
| Total Block RAM (BRAM) | 48 Kbit of embedded dual-port memory blocks |
| Distributed RAM Capacity | 12 Kbit distributed logic RAM inside CLB matrix |
| Max User I/O Lines | Up to 263 Assignable General-Purpose Input/Output Pins available |
| LVDS Differential I/O Pairs | 96 pairs high-speed LVDS differential signal interfaces |
| Speed Grade Performance | -6 Speed Grade Configuration (Highest standard performance level for the family) |
| Max System Clock Frequency | 357MHz maximum internal operating clock speed |
| DLL Clock Delay Loops | 4 independent digital Delay-Locked Loop clock management modules |
| Internal Core Voltage (V_CCINT) | 1.8 V low-voltage logic core supply rail |
| I/O Bank Voltage Options (V_CCO) | Supports 1.5V, 1.8V, 2.5V, and 3.3V peripheral output levels natively |
| Supported I/O Standards | SelectIO technology supports LVTTL, LVCMOS, PCI, LVDS, Bus-LVDS, HTL and other 19 signal standards |
| Operating Temperature Range | 0°C to +85°C Junction Temperature (TJ) Commercial-Grade Performance Bounds |
Typical Applications
- Legacy Telecommunication Routers, Data Switching Cards, and Protocol Bridge Interfaces
- Industrial Control Instrumentation, Distributed Automation PLC Logic, and CNC Machinery Boards
- Custom Video Display Processors, Timing Controllers (T-CON), and Graphic Scaling Modules
- Peripheral Device Hubs, Custom PCI/ISA Bus Expanders, and Microcontroller Co-Processors
- Automated Test Equipment (ATE) Signal Pin Drivers, Data Loggers, and Medical System Interfaces
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
Submit the Quick Inquiry form for datasheets, samples, stock checking and bulk quotations. We will reply within 24 hours.
Frequently Asked Questions
Q1: Are XC2S150E-6FG456C parts 100% original?
A: All chips are brand-new original AMD Xilinx stock with strict batch inspection. They are packed in original ESD moisture-proof JEDEC trays to protect BGA pins from oxidation and damage.
Q2: What do FG456 and suffix C stand for?
A: FG456 means 456-pin FBGA package with 1.00mm ball pitch. Suffix C represents commercial temperature grade (0°C ~ +85°C junction temperature).
Q3: What’s the difference between Spartan-2E and Spartan-2?
A: Spartan-2E adopts 0.18μm 1.8V low-voltage core instead of 2.5V. It provides more I/O resources, larger memory and native LVDS/Bus LVDS differential signal support.
Q4: How to get full technical documents and tiered bulk prices?
A: Fill in the Quick Inquiry form with your project info and required quantity. Our FPGA technical team will send official datasheets and customized quotations within 24 hours.
Q5: Can I apply for test samples of XC2S150E-6FG456C?
A: Sample service is available for prototype testing. Submit your sample demand via inquiry form, we will confirm sample cost and lead time quickly.
Q6: What is the MOQ and delivery cycle?
A: MOQ is 1 piece for spot goods. Orders ship in 1–2 working days, global delivery takes 3–7 working days via DHL, UPS or FedEx.
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