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XC7Z035-2FFG676I
XC7Z035-2FFG676I
| Part Number | XC7Z035-2FFG676I |
|---|---|
| Manufacturer | AMD Xilinx |
| Category | Integrated Circuits (ICs) > Embedded – System On Chip (SoC) / FPGAs |
| Description | Zynq-7000 All Programmable SoC integrating dual-core ARM Cortex-A9 (max 800MHz) and Kintex-7 programmable logic, 275K logic cells, 16×12.5Gbps GTX transceivers, FCBGA-676 industrial temperature grade package. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The XC7Z035-2FFG676I is mid-high performance Zynq-7000 All Programmable SoC from AMD Xilinx, integrating dual-core ARM Cortex-A9 APU and Kintex-7 FPGA on single silicon. -2 speed grade supports up to 800MHz processor clock, equipped with 275,000 logic cells and 900 DSP48E1 slices for parallel signal acceleration. Internal high-speed AXI buses connect processor and FPGA fabric to eliminate PCB latency. It carries 16 GTX serial transceivers up to 12.5Gbps for high-bandwidth communication interfaces. Packaged in thermally stable 676-ball FCBGA, industrial I grade supports -40°C ~ +100°C junction temperature, ideal for industrial control, medical imaging, SDR and avionics equipment.
Core Advantages
Tightly Coupled ARM Processor and FPGA Fabric
Dual-core Cortex-A9 processing system paired with Kintex-7 PL fabric, thousands of internal AXI high-speed channels remove board-level signal delay and integrity risks.
Massive Parallel DSP Acceleration
900 independent DSP48E1 slices support parallel high-speed math operations, perfect for radar signal processing, real-time vision and lightweight AI inference.
12.5Gbps Multi-Gigabit Serial Transceivers
16 GTX transceiver lanes up to 12.5Gbps, compatible with PCIe Gen2, 10GbE, CPRI, SATA and Aurora serial protocols for high-speed data transmission.
Industrial-Grade Wide Temperature Reliability
I suffix industrial grade with -40°C ~ +100°C max junction temperature, built-in hardware security modules and stable power management for long-lifecycle critical devices.
Key Specifications
| Brand | AMD Xilinx® Zynq®-7000 All Programmable SoC Family |
|---|---|
| RoHS Status | RoHS3 Compliant / Lead-Free / Green Manufacturing Processes Certified |
| Moisture Sensitivity Level (MSL) | MSL 3, 72-hour floor life per JEDEC standard |
| EDA/CAD Model | 3D STEP Models, Schematic Symbols, and Pinout Footprint Configurations available upon request |
| Warranty | 1-Year Standard Global Quality Warranty |
| Supply Voltage Domain | FPGA Core: 1.0V; PS MIO I/O: 1.8V / 2.5V / 3.3V configurable; GTX Transceiver: 1.0V core + 2.5V auxiliary power |
| Supported I/O Voltage Standards | LVCMOS 1.8V/2.5V/3.3V, LVDS, RSDS, Mini-LVDS, Differential HSTL, SSTL |
| Serial Configuration Interface | JTAG, SPI Flash, Quad-SPI, SD Card, Parallel NOR Flash boot modes |
| Package / Case | FCBGA-676 (27mm × 27mm × 1.0mm) |
| Mounting Type | Surface Mount Technology (SMD/SMT Lead Reflow Solder) |
| Surface Marking / Silkscreen | XC7Z035-FFG676 Marking |
| Processor Core APU | Dual-Core ARM® Cortex™-A9 MPCore with NEON™ Extension and Hardware FPU |
| Speed Grade / Max Frequency | -2 Speed Grade, APU rated maximum 800 MHz; typical industrial operating frequency 766 MHz; full-temperature stable recommended frequency 667 MHz |
| Programmable Logic Cells | 275,000 Logic Cells (Kintex-7 Equivalent Architecture) |
| Look-Up Tables (LUTs) | 171,900 Slice LUTs for complex combinatorial logic routing |
| DSP Slices | 900 Independent High-Precision Math Hardware DSP Blocks |
| Total Block RAM (BRAM) | 17.6 Mb (Mega-bits) of embedded high-speed memory arrays |
| High-Speed GTX Transceivers | 16 Serial Transceiver Lanes supporting data links up to 12.5 Gbps |
| User I/O Pin Count | 130 total user-assignable general-purpose I/O pins (PS + PL combined) |
| Operating Ambient Temperature | -40°C ~ +85°C ambient air temperature; Max junction temperature TJ: -40°C ~ +100°C |
| Operating Temperature Range | -40°C ~ +100°C maximum junction temperature (TJ), Industrial I temperature grade per Xilinx datasheet |
Typical Applications
- Software-Defined Radio (SDR), Cognitive Wireless Stations, and Satellite Communications
- Advanced Military Electronics, Radar Tracking Array Core Processing, and Avionics Systems
- High-Resolution Medical Imaging Infrastructure (Digital Ultrasound, MRI Post-Processing, CT Scanning)
- Machine Vision Inspection Engines, Multi-Axis Robotics controllers, and Autonomous Driving Platforms
- High-Definition Video Broadcasting Switches, Real-time 4K/8K Transcoding, and Professional Audio Matrices
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days after payment confirmation |
| Delivery Time | 3-7 working days worldwide via international express |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
Request full datasheets, engineering samples, stock verification or bulk tier pricing via the inquiry form. Our FPGA technical sales team replies globally within 24 hours.
Frequently Asked Questions
Q1: Is stocked XC7Z035-2FFG676I genuine brand-new original?
A: All inventory is 100% factory-original AMD Xilinx new components, packed in standard JEDEC moisture barrier trays. Every batch undergoes visual, solder ball and electrical inspection before shipment.
Q2: What does FFG676 and suffix I stand for in the part number?
A: FFG676 = 676-ball Flip-Chip BGA lead-free package; suffix I = Industrial temperature grade, rated for -40°C ~ +100°C junction temperature operation.
Q3: Why choose Zynq SoC over separate ARM CPU + standalone FPGA?
A: Discrete dual-chip designs create PCB transmission delay, extra power consumption and larger board footprint. Zynq integrates processor and FPGA on single die with internal high-bandwidth AXI buses, lowering latency, power and PCB area.
Q4: How to get official datasheet and volume bulk quotation?
A: Fill the page inquiry form with your project specifications and target order quantity, we will send full datasheet, pinout diagram and tiered bulk pricing within 24 hours.
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