K4A8G165WB-BCRC
| Part Number | K4A8G165WB-BCRC |
|---|---|
| Manufacturer | Samsung Electronics |
| Category | Integrated Circuits (ICs) > Memory > DDR4 SDRAM |
| Description | 8Gb (512M x 16) High-Speed DDR4 SDRAM, 2400 Mbps, 1333 MHz, 1.14V~1.26V, 96-FBGA(7.5×13.3mm), RoHS Halogen-Free, Commercial & Industrial Temperature Range. |
| Stock Status | In Stock |
| Origin | Original Factory |
Product Overview
The K4A8G165WB-BCRC is Samsung’s high-density 8Gb DDR4 SDRAM. Built with a 512M x 16 memory layout, it meets high-bandwidth demands for industrial automation, network equipment, embedded modules, desktop and server systems. It runs at 2400 Mbps with 1333 MHz clock frequency, adopts 1.2V low-power core supply, and integrates POD, DBI and multi bank groups to boost transmission efficiency. Housed in compact 96-ball FBGA packaging, it balances fast speed, large capacity and stable operation for heavy embedded computing scenarios.
Core Advantages
High-Bandwidth Performance
Supports up to 2400 Mbps per pin, speeding up data transmission and removing system processing bottlenecks.
Wide x16 Organization
16-bit wide bus design helps designers reach larger memory capacity with fewer chips, simplifying PCB layout.
Exceptional Energy Efficiency
1.2V operating voltage cuts overall power consumption by up to 30% vs old 1.5V DDR3 solutions, lowering device heat generation.
Advanced Hardware Data Integrity
Built-in CRC error detection, on-chip parity and programmable ODT ensure stable, error-free signal transmission.
Key Specifications
| Brand | Samsung DDR4 SDRAM Series |
|---|---|
| RoHS Status | RoHS Compliant / Lead-Free / Halogen-Free |
| EDA/CAD Model | Schematic symbols, 3D component files, and 96-ball FBGA landing templates are available upon request |
| Warranty | 1-Year Standard Quality Warranty |
| Package / Case | 96-FBGA (7.5mm × 13.3mm) |
| Mounting Type | Surface Mount (SMT / SMD) |
| Surface Marking / Silkscreen | K4A8G165WB BCRC Marking |
| Memory Architecture | DDR4 SDRAM (Double Data Rate 4) |
| Density & Bit Width | 8 Gb (8 Gigabit component, organized as 512M x 16) |
| Data Rate Support | 2400 Mbps (DDR4-2400 standard) |
| Clock Frequency | 1333 MHz |
| Standard Latency Timings | CL17-17-17 (Component Column Address Strobe Latency) |
| Internal Bank Configuration | 4 Bank Groups consisting of 4 individual banks each (Total 16 internal banks) |
| Operating Voltage (VDD / VDDQ) | 1.2V ± 0.06V, operating range: 1.14V ~ 1.26V |
| Activation Voltage (VPP) | 2.5V ± 0.125V (DDR4 pump voltage supply rail, range: 2.375V ~ 2.625V) |
| Operating Temperature Range | 0°C to +85°C (Standard commercial grade); -40°C ~ +95°C (Industrial extended temperature) |
| Category Classification | Integrated Circuits > Memory IC > DDR SDRAM |
Typical Applications
- High-performance personal computers, thin laptops, and multi-core servers
- Industrial automation controllers, embedded single-board computers (SBC), and edge computing devices
- Enterprise-tier networking equipment, core routers, high-speed hardware firewalls, and network switches
- High-definition smart TVs, television set-top boxes, and multimedia streaming base stations
- Automotive cockpit computing, advanced telemetry clusters, and high-tier camera tracking hardware
Order & Shipping Info
| Minimum Order Quantity (MOQ) | 1 Piece |
|---|---|
| Shipping Time | Shipped within 1-2 business days |
| Delivery Time | 3-7 working days worldwide |
| Shipping Methods | DHL, UPS, FedEx, EMS |
| Payment Methods | T/T (Bank Transfer), PayPal, Credit Card, Western Union |
Technical Support
For datasheet, sample requests, stock check, or bulk pricing, please use the Quick Inquiry form. We will reply within 24 hours.
Frequently Asked Questions
Q1: What does the “BCRC” suffix stand for in this Samsung memory model?
A: “BC” stands for commercial temperature 96-FBGA lead-free packaging; “RC” represents performance grade, matched with DDR4-2400 and CL17 timing parameters.
Q2: What advantages does the 512M x16 layout bring compared with x8 layout?
A: The x16 16-bit bus can build a 64-bit memory channel with only 4 chips, fewer components simplify PCB wiring and save board space versus 8pcs x8 chips.
Q3: Why does DDR4 need an independent 2.5V VPP power supply?
A: The 2.5V auxiliary VPP rail drives internal wordline activation separately from the 1.2V main core voltage, cutting power consumption during idle periods.
Q4: Is K4A8G165WB-BCRC pin-to-pin compatible with DDR3 motherboards?
A: Not compatible. DDR4 has different electrical signals, pin definition, notch position and command protocol, cannot work on DDR3 hardware.
Q5: What temperature range does this chip support?
A: Standard commercial range 0°C ~ +85°C; it also supports extended industrial temperature -40°C ~ +95°C for industrial equipment.
Q6: Can I apply for free samples of K4A8G165WB-BCRC?
A: Yes, submit your demand via Quick Inquiry form, we support small sample testing for qualified corporate buyers.
Q7: What is the physical size of this 96-FBGA package?
A: Package dimension is 7.5mm × 13.3mm, SMT surface mount process for PCB welding.
Q8: Is this memory RoHS and halogen-free compliant?
A: Fully RoHS compliant, lead-free and halogen-free, meets global environmental standards.
Q9: What is the warranty period for bulk order chips?
A: We provide 1-year quality warranty for all original Samsung memory ICs.
Q10: What equipment is this DDR4 chip commonly used in?
A: Widely used in industrial automation, network switches, embedded modules, desktop PCs and entry-level servers.

